Electronics Forum | Wed Oct 14 13:52:59 EDT 1998 | Bill Schreiber
Dear Sanjay, An important issue involved when stencil printing adhesives vs. solder paste is: How do you clean the stencils after printing? Do you need two machines? Two chemistries? Two waste streams? What are the potential environmental impacts an
Electronics Forum | Wed Jul 11 18:32:34 EDT 2001 | Darby
Mark, We print and dispense with Amicon "D 125 F". Solvent used is Electrolube "SSS", which is also used for solder paste removal/pcb cleaning for misprints and rework both manually and ultrasonically. I like it - good stuff but at $25 AU per litre i
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Sat Aug 07 11:10:03 EDT 1999 | JohnW
| Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. | My regular stencil manufacturer recommend the following: | Thickness: 8 mils | 0805 opening: Oblong
Electronics Forum | Thu Oct 11 17:44:30 EDT 2001 | aaelect
OK, OK. 672 ball BGA. The pcbs are PC Card bus size and are .015 thick. There are 3 on a panel with about 1/2" between and rails. The aluminum plates are about 3" by 7". There are 3 cutouts which allow for the parts from either side to protrude du
Electronics Forum | Mon Jul 26 14:14:51 EDT 1999 | Steve Gregory
| | | We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | | | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is th
Electronics Forum | Wed Jul 03 14:08:10 EDT 2002 | gbriceno
I' designing a PCB with SMD components to optimize the land patterns for wave soldering. I find that the IPC-SM-782 land patterns are not robust enough for wave soldering, yielding ramdom skips and bridges. This PCB will also give me insight on sha
Electronics Forum | Thu Aug 11 15:11:35 EDT 2011 | davef
Franx: In response to your follow-up questions ... For the case 1: Q1: Should I apply the glue to the PCB with the same method as I apply solder paste? (with screen printer and squeegee). A1: Correct. Glue can be stencil printed, dispensed, or pin t
Electronics Forum | Tue Sep 18 12:10:39 EDT 2007 | wailiang81
Hi, good day to all. This is my 1st question post in this forum. Hope able to share some knowledge here. As we know QFP area like 0.4mm pitch was a very critical area to control especially those PCB using silkscreen printing process manufactured. Onc
Electronics Forum | Tue Oct 24 19:40:40 EDT 2000 | Dave F
From the SMTnet Library Terms & Definitions [er whatever they call it] � Emulsion. A material that suppliers build-up on a printing screen to block portions of the screen. The un-blocked (open) portion of the screen define the pattern for depositi
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