Electronics Forum | Tue Jun 02 21:27:22 EDT 2009 | davef
We've never heard of a situtation where oversized pads caused voiding. Your supplier is correct that the pads on the board should be the same size as the pads on the interposer, but this is to improve reliability issues. Search the fine SMTnet Archi
Electronics Forum | Thu Jun 04 20:06:30 EDT 2009 | davef
Since posting the above comment extolling the virtues of NSMD pads and disparaging SMD pads, we've learned that the points apply to all array devices, but in spite of that some designers of fine pitch [eg, 0.4, 0.5mm pitch] array devices choose SMD w
Electronics Forum | Fri Jan 22 16:03:17 EST 2021 | SMTA-64387124
Does anyone see any issues in mixing SMD and NSMD pads within one BGA footprint. We have high current pads which we want to make SMD and the other signal pads to be NSMD
Electronics Forum | Mon Nov 30 08:39:05 EST 2015 | spoiltforchoice
http://blog.screamingcircuits.com/2010/09/smd-vs-nsmd.html such as this? Which handily also tells you what you might want to google.
Electronics Forum | Fri Jan 22 02:53:30 EST 2010 | sparrow
hello, can anybody help to compare SAM to x-ray methods with regard to inspection of semiconductor devices (smd LEDs, for instance)? Advantages and disadvantages of each method? Thank you!
Electronics Forum | Fri Jun 26 13:52:05 EDT 1998 | jcc
| We are currently comparing the Fuji QP2 machine to the Universal GSM. The primary use will be for QFP's down to .4 mm pitch and for 300+I/O BGAs. My initial input has been that you spend alot of time tweeking PD's on the QP because the vision sys
Electronics Forum | Wed Sep 16 15:40:32 EDT 1998 | smd
2,000/year usage on reels.
Electronics Forum | Thu Nov 20 04:00:36 EST 2008 | caerleon
Our sub-contractors will be using SMD600. Thankyou all for your replies much appriciated.
Electronics Forum | Wed Nov 19 06:02:22 EST 2008 | caerleon
Hi all, I have been in the game for near on 15 years and finally something has stumped me! As this site has always provided a wealth of knowledge and at times some amusement I have decided to post it here. Ok. My company uses a test method on an Om
Electronics Forum | Thu Oct 25 13:35:47 EDT 2012 | davef
Here's a paper that may help http://www.ipcoutlook.org/pdf/assembly_challenges_bottom_terminated_ipc.pdf Temperature Impact * Profile didn’t have a significant impact on voiding. * Voids slightly increased with higher temperature. Reflow Atmosp
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