Electronics Forum | Tue Mar 24 11:20:18 EST 1998 | Earl Moon
| Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via? Typically, micro vias are drilled and plated to about .003" diameter. To avoid significant solder "drain off," they should be drilled as shallow
Electronics Forum | Wed Mar 25 16:38:21 EST 1998 | Steve Joy
We have successfully put .016" vias in .030" pads. There is no issue with .030" solder balls, since the actual volume of the .002" via in pad is small compared to the ball+solder paste volume. We did notice random bubbles where, apparently, the sol
Electronics Forum | Wed Mar 25 16:36:10 EST 1998 | Steve Joy
We have successfully put .016" vias in .030" pads. There is no drain off with .030" solder balls, since the actual volume in the .002" depression is low. We did notice random bubbles where, apparently, the solder reflowed and trapped the air in the
Electronics Forum | Wed Mar 25 19:41:01 EST 1998 | Earl Moon
| We have successfully put .016" vias in .030" pads. | There is no drain off with .030" solder balls, since | the actual volume in the .002" depression is low. | We did notice random bubbles where, apparently, the | solder reflowed and trapped the a
Electronics Forum | Tue Apr 17 14:57:10 EDT 2007 | ratsalad
Hi there CK, I didn't follow the link yet, but I thought I'd comment on your post here. I've attended two engineering schools in the USA, and one of them was a pretty darn good school. At both, I would have to say about 80%+ of the graduate studen
Electronics Forum | Wed Aug 10 10:14:18 EDT 2011 | lisalau
Below is a cheating experience from one of my friends. To all SMT friends___a cheating experience to share with you We made payment to Autento Electronics in Singaporen on OCT 30th,2009 to purchase Siemens Feeders,and they agreed to make shipment w
Electronics Forum | Wed Jan 11 18:59:22 EST 2023 | agrivon
At SMT assembly level, the main HiP mitigation actions to consider should be increasing the stencil thickness/aperture sizes (typically in the 4 corners where warpage is maximal) + possibly reducing the reflow peak temperature as probably indicated i
Electronics Forum | Fri May 14 15:03:19 EDT 1999 | lima
| | Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | | | My concern is the volatiles in my WS629 solder paste may be
Electronics Forum | Mon Jul 18 22:31:25 EDT 2016 | cmchoue
Hello, Experts I have a question about Through hole SMD part in SMT process The PIN Length can't over PCB board how many that will happen defect? any advice or data(IPC rule maybe) ? Thanks Wish you have a nice day
Electronics Forum | Sat Sep 29 19:04:13 EDT 2012 | e_music
Hello, I have just installed the demo version of GC-Powerplace. Could anyone here walk me through the process to generate pick and place file from gerbers? I don't have solderpaste layer. All I have got is signal layers (top/bottom), soldermask, sil
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