Electronics Forum | Mon Oct 16 17:46:49 EDT 2006 | Dan
Recently I was given a bad Bios Link from Toshiba which fried my Bios and now my laptop boots to a black screen. I recently unsoldered and removed the existing Bios chip and have ordered anotherfor replacement. Unfortunately while removing, i damag
Electronics Forum | Tue Apr 09 16:19:37 EDT 2002 | Peter L.
Has anyone built using the ALIVH PCB (0402, 0.8mm pitch uBGA) on the SMT line? I would like to know any process issues (paste printing, p&p, reflow) related to processing this pcb. Specifically, what type of solder paste was used (no clean) and wha
Electronics Forum | Fri Mar 04 11:00:37 EST 2005 | mrduckmann2000
Anybody have any ideas on the proper way to screen solder mask onto a PCB? I am going to cover SMT parts that were soldered to the btm side of the PCB, now I have to mask them in order to run this animal through the wave solder process. I know it w
Electronics Forum | Wed Mar 27 10:32:29 EST 2002 | barryg
hello evryone. I am rleatively new to smt production. Though we have been successfully running pcb assy's and getting very good solder quality we are trying to get some proccess control parameters set up for our printing process. We have a semiauto s
Electronics Forum | Wed Oct 14 13:52:59 EDT 1998 | Bill Schreiber
Dear Sanjay, An important issue involved when stencil printing adhesives vs. solder paste is: How do you clean the stencils after printing? Do you need two machines? Two chemistries? Two waste streams? What are the potential environmental impacts an
Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf
“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of
Electronics Forum | Wed Dec 03 11:55:42 EST 2014 | spoiltforchoice
I think there are several answers: 1)Design Fail - slap whoever created it 2)Fit that connector as a manual process after the PCB is finished. 3)Print side 2 using a jet printer 4) Shield the fragile LGA and reflow it twice anyway. 5)Use a thicker PC
Electronics Forum | Tue Mar 01 10:21:55 EST 2005 | davef
IPC Plating Committee is presently working on a specification for immersion tin [IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards] as a solderable surface finish. Immersion tin is normally deposited at 30 to 60 microinches.
Electronics Forum | Wed Dec 03 10:44:03 EST 2014 | kkay
We have a smt connector on side one of our pcb that overhangs through the board to the second side. We can't figure out how to print the second side with this part sticking out. Unfortunately we cannot run the second side first due to an LGA that has
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
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