Electronics Forum | Thu Aug 10 05:53:10 EDT 2000 | pascal MATHIEU
hello everybody , i am looking for the elementary caution you need to take when you reflow large board with several thousands of smt components . thank you for your advise
Electronics Forum | Tue May 04 10:59:23 EDT 2004 | Evtimov
Hi, It depends of your boards(are they for SMD or not) and how many boards you assemble. The process at all is like that: 1.Stencil printer - to adjust the paste 2. Pick and place machine(for your quantity) 3.Reflow oven Theese are the machines you
Electronics Forum | Wed Jul 13 14:50:29 EDT 2005 | rameshn
Dear Sir, We are manufacturing Computer Motherboards & Networking products (which are having 2 to 3 BGA Chips onboard) in our plant. we are having 2 nos of HELLER 1800W model Reflow Ovens. this model reflow oven is having 9 heating zones at both top
Electronics Forum | Wed Nov 15 15:51:21 EST 2006 | RJ K.
I have been looking into buying a rework station like ERSA or PDR. What I am questioning is how well will these systems reflow BGA's with metal top/cover that are reflective. In addition, when preheating the board would dark body packages absorb te
Electronics Forum | Thu May 06 18:36:06 EDT 2004 | gustavo
I can help you, if define what type of components you used: Thru hole(axial,radial, pin insertion etc..) axial: milimetrics or standar(span of .200" or .350" ) radial 2.5mm , 5mm or 7.5 mm SMT (chip shooter(1206,0805,0603 ,sot 23 etc or more small
Electronics Forum | Thu Aug 10 21:59:14 EDT 2000 | Dave F
Pascal: Two elementary cautines are: 1 Don't dump the board before the reflowed solder is cooled. 2 Try to manage the side to side temperature variations in your oven. I wouldn't be surprised to see 5�C variation. Good luck
Electronics Forum | Mon Nov 01 06:19:45 EST 1999 | Michael Fogel
I suggest tow more ways: 1. try to differ the temperaturte between top and bottom side duering the reflow process. 2. try to add some glue dots under the falling parts befor the placement/reflow process Good luck Michael
Electronics Forum | Mon Nov 01 06:27:15 EST 1999 | Michael Fogel
I suggest tow more ways: 1. try to differ the temperaturte between top and bottom side duering the reflow process. 2. try to add some glue dots under the falling parts befor the placement/reflow process Good luck Michael
Electronics Forum | Thu Oct 20 11:52:07 EDT 2005 | Amol
there are various SMT machines 1. Stencil Printer 2. Pick and Place machine 3. Reflow ovens 4. Automatic optical Inspection machines start with visitng Stencil printer websites like MPM, DEK etc. Pick and Place -- Univesal instruments, Mydata, Fuji
Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben
I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i
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