Electronics Forum | Mon Dec 11 15:12:20 EST 2000 | accuspec
we are using alphametals no clean 95sn/5ag CL775 paste. After reflow there are solder balls on the board. mainly are around the cap. We are using a conceptronic concept 60 air. There are 4 zones with 8 chambers. We are not sure what the profile
Electronics Forum | Wed Mar 21 13:47:16 EDT 2012 | jax
To have an Operating Temp (Tool Classification) within your range, you might want to try. PB85 (Pb85/Sb10/Sn5) SMT is normally processed using Vapor Phase but can also be achieved with Nitrogen assisted Convection Reflow depending on size and compl
Electronics Forum | Sun Sep 13 09:21:26 EDT 2009 | davef
You as, "What data is available showing the long term reliability of the intermetallics of the solder joints?" Alloy||Microstructure Sn-Pb||Lamella or globules Sn-Cu||Sn-matrix, Cu6Sn5 needles or globules Sn-Cu-Sb||Sn-matrix, cuboids of SbSn and Cu6
Electronics Forum | Mon Nov 14 10:10:52 EST 2005 | davef
When soldering your full tin (no lead) and Pb95/Sn5 solder components, you need to modify your PbSn reflow recipe to compensate for the higher melting point of the changed solder alloy [with your Sn62/Pb36/Ag2 solder paste] on those component leads.
Electronics Forum | Thu Nov 10 08:23:35 EST 2005 | arclightzero
Hello, I am currently trying to isolate internal fallout problems with very low yield substrates mixed with great yields and have recently found that we are using a Sn62/Pb36/Ag2 solder paste with full tin (no lead) components as well as Pb95/Sn5 sol
Electronics Forum | Wed Aug 24 03:12:01 EDT 2011 | richieoreilly
Hi, The solder we use is Sn5Pb93.5Ag1.5. with a melting point of about 30 degrees.
Electronics Forum | Wed Nov 20 18:41:57 EST 2002 | slthomas
Here's part of what I could read: "We evaluated the influence of Lift-off (Fillet-lifting) and the influence of thermal fatigue, in this case on combination between various terminal platings of electronic components and Pb-free solder, Sn-37Pb solde
Electronics Forum | Mon Dec 28 08:51:45 EST 2009 | jax
What solder are you talking about and what reflow method are you using? High Melt Alloys: SN96 (Sn96/Ag4 or Sn96.5/Ag3.5) - Simliar to SAC305 although normally uses Rosin based flux that can required more extensive cleaning. Pb85 (Pb85/Sb10/Sn5) -
Electronics Forum | Thu Aug 20 15:10:21 EDT 2009 | davef
Responding to your points: * The intermettalic layers [ie, Cu6Sn5, Cu3Sn] between the solder and the copper pad is the same composition with both lead free and leaded solder. The lead in solder has no impact on the intermetallic. * As you say, increa
Electronics Forum | Mon May 20 09:24:32 EDT 2013 | davef
SAC / Ni interface is the IMC (Cu, Ni)6Sn5
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