Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack
Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg
Electronics Forum | Fri Mar 06 02:47:15 EST 2009 | lococost
Have you tried higher peaktemp? I saw the QFP is sn90pb10, This has a liquidus of 268 - 302 C. A good paste should be able to handle 230C (or more), of course you would need to check your other components peak temp.
Electronics Forum | Thu Mar 12 06:37:48 EDT 2009 | gregoryyork
I agree you are too cold for the profile get it up to 230C and possibly allow it to dwell a little longer in preheat as opposed to pushing up the reflow zone only. Sn90/Pb10 melts at 220C so 2C hotter than your profile so you are reliant on it alloyi
Electronics Forum | Mon May 09 16:44:33 EDT 2011 | dcell_1t
Hi, We have been struggling with an issue of non wetting on a QFP (Renesas - 256, Sn90Pb10) but the issue "desapears" sometimes for a while and then back again suddenly. This is the scenario: Component: QFP 256 / Renesas / Sn90Pb10 / 0.5 mm pitch S
Electronics Forum | Fri Mar 19 11:48:06 EST 2004 | Ken
This is the dilema during this transition period. Here is a tip: If you see typcial solder joints on a lead free process, but only on one component type....it probably has a significant quantity of lead in it (ex. Sn90/Pb10...and so on) If using T
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