Electronics Forum | Mon Jun 07 17:28:07 EDT 2004 | edatasys
LSP is 'Long Soak Profile'. See http://www.aimsolder.com/tds/NC_297DX_Sn62_&_Sn63_Solder_Paste.pdf Looks like a variation of the RSS, with you guessed it a longer soak.
Electronics Forum | Thu Sep 07 10:03:30 EDT 2000 | KS Wong
Hello, I am looking for input on the 7 zone convectional reflow oven on the temperature profiling. I having a problem with the flux/solder spattering on the Au cotact fingers. I have ran some experiment with the soak time and reflow time. Anyway,
Electronics Forum | Sat Nov 25 21:18:03 EST 2006 | callckq
Dear all, I would like to learn from all regarding purpose of each profile stages, such as preheat, soak, peak cooling. At what stages, flux start to be activated? Thanks for your time,
Electronics Forum | Mon Jun 07 10:05:18 EDT 2004 | adm
Hi Russ I happen to come across a article about reflow profile. Other than Ramp-to-spike(RTS) & Ramp-soak-spike(RSS), its introduce a new reflow profile & call it LSP. Is it possible to give me your email address & I will send the article to you?
Electronics Forum | Wed Feb 20 11:40:31 EST 2019 | bmalhi
Heller Oven comes with a profile pre-loaded so you can start there. RTS = Ramp to Spike. Basically a straight line from preheat to spike. Also known as “Tent” profile RSS = Ramp Soak Spike. This one creates a flat line around 150-180 degrees on th
Electronics Forum | Wed Nov 11 09:51:42 EST 2009 | rajeshwara
try less soak 130 to 225 for lead free : 70-80 sec
Electronics Forum | Wed Mar 24 10:04:09 EST 2004 | Marc Apell
183C, 60 +- 15 seconds). The quesiton to use a straight ramp or soak profile comes down to the product your are soldering. The key is to get the whole assembly at the same peak temp (minimized delta) and same TAL for effective formation of the so
Electronics Forum | Tue Sep 02 13:30:11 EDT 2008 | hermes
Try this. Basic reflow profile build up and explanation of its parts: ramp-up, soak or no soak, peak, cooling. Good starting point.
Electronics Forum | Sat Oct 01 01:25:30 EDT 2005 | ck
Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time
Electronics Forum | Wed Mar 24 08:37:32 EST 2004 | steveliu
Hi, Guys, Can anybody tell me what kind of reflow profile is best for a no clean solder paste: Ramp-Soak-Spike or Ramp-to Spike? The paste we are using is AIM 293DX2B. Thanks a lot.
