Electronics Forum | Thu Dec 24 13:29:19 EST 1998 | Chris Grendler
| | Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The
Electronics Forum | Thu Dec 03 11:11:01 EST 1998 | David Pinsky
| Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | Any in
Electronics Forum | Thu Dec 03 11:41:05 EST 1998 | Earl Moon
| | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | | An
Electronics Forum | Thu Dec 03 12:43:38 EST 1998 | Ryan Jennens
| | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | | An
Electronics Forum | Tue Oct 27 09:05:29 EST 1998 | Mike Scott
Has anyone found a way to control viscosity of no-clean paste?
Electronics Forum | Mon Oct 26 11:11:48 EST 1998 | John Hardy
We have installed a Sonoflux atomized mist fluxing unit (Model 9500)on our Future 1 wave solder machine. We are concerned that the retrofitting of this unit may not have been appropriate for our equipment, as we are now experiencing many problems wi
Electronics Forum | Mon Oct 19 13:32:06 EDT 1998 | Mark Schwarz
| How are solder pastes manufactured right from the level of extracting lead and tin ? | | | The Tin Institute is good but I rarely find that the raw metals industries guys know about pastes. Making a tin-lead alloy for pastes, as for raw bars, is
Electronics Forum | Thu Oct 01 16:57:47 EDT 1998 | ETS, LLC
For information on Convection Solder Reflow Ovens: www.eznet.com/~ets
Electronics Forum | Thu Oct 01 13:31:09 EDT 1998 | FRANK
Assuming that you do not have a solderability problem with the board or part it sounds like you are not pumping the solder up high enough to contact the board plus push into the board by about 1.8mm. Are you using a chip wave in front of the normal
Electronics Forum | Tue Sep 22 09:07:02 EDT 1998 | Steve Gregory
Hi Jacqueline! Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? If that is true, are there many vias concentrated aroun
