Electronics Forum: solder a (Page 517 of 1484)

Softbeam profile

Electronics Forum | Tue Oct 15 11:31:10 EDT 2002 | russ

I wouldn't think so, A thermocouple can be attached to the lead that is being soldered. Russ

replating gold fingers

Electronics Forum | Mon Jul 31 14:51:31 EDT 2006 | bhu

Can anyone suggest a supplier for gold solution when replating gold fingers that had solder on them?

Floor life pcb assembly

Electronics Forum | Wed Apr 23 07:27:21 EDT 2008 | realchunks

Floor life of a PCB is rated in years. Are you asking about the solder paste or something else?

Lead Free

Electronics Forum | Tue Feb 03 21:36:29 EST 2009 | davef

NASA gets itself in a froth about the potental for whisker growth in high tin solders used in space applications.

Palladium poor wetting

Electronics Forum | Tue May 23 09:50:37 EDT 2006 | flipit

They work well in silver conductive epoxy in hybrid applications. They are very poor in no clean applications. They don't work that well in OA solder paste either. Used them once in OA paste and in a nitrogen. They looked just fine. Solder to Pd

SMT LEDS SOLDERING

Electronics Forum | Tue Sep 09 11:53:36 EDT 2008 | davef

We consider "IR-reflow soldering profile" to be the supplier's recommended reflow thermal profile that a component temination 'sees' for proper soldering, regardless of the method used to reach that temperature. When you say, "We have a lot of defec

Double-Sided BGA Process

Electronics Forum | Tue Sep 14 13:54:13 EDT 2004 | paul_boxboro

I'm with Chris' approach as a first effort. If you don't have any luck, consider using a high (reflow)temp solder paste for the first pass reflow, and your standard solder paste for the second pass refow. Years ago I had a similiar challenge with an

Solder paste change

Electronics Forum | Mon Mar 31 01:11:14 EST 2003 | yukim

Hi, we are about to change solder paste for cost issue. Currently using a no clean Sn63 solder paste and tried several others, all no clean, Sn63 and Sn62. Want to ask about reliability test: we did thermal shock test for 8 days. The flux residue cha

PIP plus

Electronics Forum | Mon May 08 22:39:18 EDT 2006 | smartasp

I have read an interesting article on pip plus, where they say "However, both PIP processing and the use of solder preforms are well-proven methods. The combination of pin-in-paste plus solder preforms delivers numerous benefits compared to a combi

COB pad contamination from kapton tape adhesive

Electronics Forum | Tue Jul 10 07:22:48 EDT 2007 | davef

Q1. Is kapton tape an industry accepted way of protecting gold pads from solder splashes? A1. No. It is more accepted to resolve the reason behind the solder splats, so that the added labor and cost of taping is eliminated. Search the fine SMTnet Arc


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