Electronics Forum | Mon Apr 26 20:14:48 EDT 2021 | goldendragon
Hello gen, Is there any recommendation of a liquid flux for SN100 solder bar on wave? Appreciates!
Electronics Forum | Mon May 20 13:14:05 EDT 2024 | dontfeedphils
I almost always go with an overprint as long as it's feasible. I haven't had much problem with solder-balling when overprinting. I'd give it a try and see how it works for you.
Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef
Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies
Electronics Forum | Thu May 25 03:31:17 EDT 2006 | slaine
Hi I manufacture ceramic parts that have a terminations that are palladium/platinum/silver or any combination of the 3. Termination Ink usually consists of 3 main parts the alloy, glass frit and binder. Binder is to help bind everything together whi
Electronics Forum | Fri Dec 28 11:33:36 EST 2007 | realchunks
It really depends on several things. Is solder paste inspection driven from the customer? Do you have a lot of time and bodies to do solder paste inspection? Does it add value to your process? If you answered �Yes� to any of the above, then you a
Electronics Forum | Tue Feb 21 17:08:16 EST 2012 | cellis
We finally can't avoid adding wave solder to our > process anymore. For lead-free, medium sized wave > I'm leaning towards mid 2000s senju units as the > best fit. I've never run their equipment. > Opinions? > > As a point of reference for our
Electronics Forum | Thu Mar 17 10:56:24 EST 2005 | jmedernach
Hi John, This problem is interesting. I've never had a problem with solder shorts caused by subjecting a device to reflow a second time. I've built many double sided SMT assemblies with fine pitch devices on top and bottom. Some things to possibly
Electronics Forum | Tue Aug 18 16:10:40 EDT 1998 | Earl Moon
| Question: | If a PCB and the lands of a part both had electroless plating, would there be a higher tendancy for intermetallics to form in and on the solderjoint...versus just the PCB or Just the part being plated? | I'm currently running into this
Electronics Forum | Wed Sep 08 15:16:50 EDT 1999 | Jason Gregory
| | | Hello: | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the ov
Electronics Forum | Wed Sep 08 17:34:26 EDT 1999 | Earl Moon
| | | | Hello: | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into th
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