Electronics Forum | Wed Jun 14 18:21:23 EDT 2000 | Robert Moore
It has been our experience that the problem you have discribed was not solder process related. We had two such instances in the past and both were component related. The first case involved a PLCC28 that failed test. Reflowing the solder seemed to co
Electronics Forum | Tue Dec 14 10:36:42 EST 1999 | Paul Peterson
I recently encountered reflow soldering defects on a pair diode package, the smd pad had a green contamination, I'm convinced that this is not oxidation. The no-solder condition appears to be caused by a sloppy soldermask process, although over the y
Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
Electronics Forum | Thu Oct 25 04:52:17 EDT 2001 | Vai
I'm running intrusive reflow. What happened was when the board went thru' the first reflow ( which is secondary side ), at Post reflow, I can see the solder joint quality is very good smooth and shiny. But when we proceed with the 2nd reflow, at Post
Electronics Forum | Mon Feb 02 12:36:41 EST 2004 | paul_bmc
90% of the assemblies our company produces are class 3 and we have no problem at all inspecting or getting class 3 quality through reflow. Rarely do we have touch up because of insufficient or poorly reflowed solder joints. What are the problems you
Electronics Forum | Wed Jul 03 03:02:35 EDT 2013 | autoel
How to test the reflow solder joint shear strength? What are the specification to test solder joint shear strength? What are the different methods to test the solder joint shear strength? Vijayashree
Electronics Forum | Wed Jan 28 14:35:12 EST 2004 | swagner
Has anyone in the industry had even a fair amount of success inspecting reflowed solder joints to IPC class 3 standards? I am not interested in hearing from system reps or people who work for an AOI manufacturer. Thanks,
Electronics Forum | Mon Feb 02 17:52:11 EST 2004 | swagner
We are not having a problem, we have a customer that would like us to use post reflow AOI to inspect the solder joints to class three. I would like to see if anyone is having sucess doing this.
Electronics Forum | Tue Feb 03 12:24:56 EST 2004 | swagner
Paul, do you have any kind of false failure data for the application you struggled with? Also what amount of manpower did you use to operate the system(s).
Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto
Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures
