Electronics Forum | Mon Aug 24 07:16:52 EDT 1998 | Paul Horan
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
Electronics Forum | Thu Aug 06 10:30:41 EDT 1998 | Mike
| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t
Electronics Forum | Mon Aug 24 07:12:20 EDT 1998 | Paul Horan
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
Electronics Forum | Fri Aug 07 02:32:09 EDT 1998 | P.L. Sorenson - Technical Consultant
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
Electronics Forum | Tue Nov 13 12:25:12 EST 2007 | gradloff
I have a thick board with ground planes that will be soldered by hand with a mildly active solder/flux. X-ray confirmed that solder was added to the top of the joint causing a void between the bottom and top solder joint. Other than the mildly acti
Electronics Forum | Mon Mar 22 09:37:28 EST 2004 | ellis
After 2nd time reflow of double reflow, wrinkles solder joints found on SOIC and SOT components.(only happen on the components at the underside of pcb during reflow, top side components dont have this problem) is this due to the reflow process proble
Electronics Forum | Fri Oct 30 15:09:44 EST 1998 | ChungPark
| Dear all, | | What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rew
Electronics Forum | Thu Dec 09 15:19:21 EST 2004 | nrocco
Can anyone point me in the direction to find some IPC standards for lead free solder joint reliablity tests, such as shear tests, pull tests, vibe tests, enviroment tests, etc. I need to know what the specs. are on all aspects of reliability and how
Electronics Forum | Thu Dec 09 17:45:27 EST 2004 | davef
You're correct. There is no criteria for no-lead, but there none for SnPb, either. Solder joint strength in pull/shear will vary with lead geometry, solder volume, lead metal/metallization, the way the test is done.
Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon
| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This
