Electronics Forum | Thu Apr 20 02:17:15 EDT 2017 | cromaclear
Hello to all, I am having a serious problem on my ersa versaflow 3 machine. This is a selective soldering machine and a problem is in less soldering material on the pins, you can see it in the picture http://imgur.com/a/FC2a1 Do you have any idea how
Electronics Forum | Thu Apr 20 02:59:58 EDT 2017 | cromaclear
The temperature in the pots are 310C
Electronics Forum | Thu Apr 20 11:59:34 EDT 2017 | cromaclear
Surface finish is Tin 7 microns thick
Electronics Forum | Thu Apr 20 02:44:39 EDT 2017 | tsvetan
The hole is too big, you should reduce the size in the next PCB revision. The middle joint is soldered at low temperature you can see how the solder didn't distributed evently and cooled on waves. The solder joint at the bottom didn't wet the capac
Electronics Forum | Thu Apr 20 02:37:33 EDT 2017 | cromaclear
Parameters are all the same, the pin is only connected to the capacitor.I will check about surface finish with my logistics.
Electronics Forum | Thu Apr 20 02:27:11 EDT 2017 | pavel_murtishev
Mile, Please tell me more about your soldering process: - Are soldering process parameters the same for all three pins? - Is unsoldered pin connected to thermal heavy copper polygon? - What is your board surface finish? HASL? - Sn/Pb or LF process?
Electronics Forum | Thu Apr 20 03:50:35 EDT 2017 | cromaclear
To overcome the dewetting issues of the past, a number of techniques have been used such as alternating directions on the wetted nozzle; this helps to avoid the solder biasing to one side causing the other side to oxidize and de-wet. Another method o
Electronics Forum | Mon May 01 12:32:50 EDT 2017 | emeto
Looks like you have bad wetting. I will do in this order as it is easier to troubleshoot starting with the machine and transitioning to the PCB: 1. First clean some bare PCBs really good and try again. 2. Check thermal profile 3. Check flux - amount
Electronics Forum | Tue Mar 20 20:14:40 EST 2001 | davef
Electroplating [electrolytic] and dipping [HASL] are the two methods for applying solder coatings to features on boards. Disadvantages of electroplating lead / tin are: * "Weak knees" created at the edge of plated through holes. [I used to get weak k
Electronics Forum | Thu Apr 15 14:36:06 EDT 2004 | Ted
I need solder that has a solidus temp. of approximately 260C so that when sent through a second reflow of 260C the solder doesn�t become liquidus. However, I need the max reflow to be less that 300C because of the substrate.
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