Electronics Forum | Thu Aug 12 22:31:10 EDT 1999 | Dave F
| Hello, | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | B.Regards, | Felix | Felix: There are some 30 variables that affect SMT solder qua
Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas
Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi
Electronics Forum | Thu May 09 18:06:42 EDT 2002 | bcceng
janchan, don't know how many LGA's/LCC/BCC's you are placing but a short term solution that I can recommend is the application of solder bumps to the component and than place it after board has gone through reflow or even at the same time. Our compa
Electronics Forum | Thu May 09 11:59:34 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Thu May 09 12:00:32 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Thu Jun 17 17:05:56 EDT 1999 | Chrys Shea
| Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | for example: | | Solder Bridge | 1.verify amount of flux been aplied. | 2.verify turbulance on your solder wave. | 3.etc.
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
Electronics Forum | Thu Aug 12 05:06:12 EDT 1999 | FMung
Hello, Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... B.Regards, Felix
Electronics Forum | Mon Jan 20 22:39:46 EST 2003 | davef
Hi Stevo, Most paste suppliers say something like, �above 183*C for 45 to 60 seconds.� The problem we have with statements like that is that they seem to assume that the pads, component leads, and solder paste are all near eutectic 60/40 solder. A
Electronics Forum | Wed Jan 22 14:53:50 EST 2003 | MA/NY DDave
Hi I thought I would come back to this one for a second. Joe Fox above gave a nice concise note as to why you must raise the temp high enough above the soldering melting temp (liquidus) yet not too high. You want to go high enough for paste so tha
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