Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Mon Aug 16 04:38:18 EDT 1999 | Earl Moon
| Hello | I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce
Electronics Forum | Fri Apr 15 09:10:09 EDT 2005 | Dhanish
The biggest problem I am having is the X-Ray and ICT could not detect this shorts.ICT could not detect because onboard measurement shows Zero even without the Hair line shorts.With Hairline there is no difference in the impedance value for ICT to fai
Electronics Forum | Wed Apr 13 21:47:32 EDT 2005 | Dhanish
In production,we are seeing high defect for Hair Line Solder Shorts for PTH connector and the Hair Line is too tiny that X-Ray and ICT could not detect.Any suggestion on how we can resolve or at least detect this upfront.
Electronics Forum | Thu Apr 14 18:51:19 EDT 2005 | KEN
What side is the short occuring on. Topside or bottom (solder) side? 2. Pitch of hole pattern = ? 3. Your x-ray may not have the resolution or DSP capable of detecting this defect. How does your profile look? Is this a true short or the result
Electronics Forum | Mon Feb 18 17:27:03 EST 2002 | hgwells
Agilent has a great article on determining whether automated optical inspection (AOI) or automated x-ray inspection (AXI) is right for you. It's a PDF file that can found here: http://www.ate.agilent.com/EMT/LIBRARY/X-RAY/DOCS/59883661en.pdf To sum
Electronics Forum | Fri Sep 12 22:57:13 EDT 2003 | Dean
What is the surface finish of the PCB? Tin? Imersion Silver? What flux is used in wave solder and / or SMT? I have much experience with silver migration and tin wiskers. Both can disappear during a reqork cycle. Both can be extremely difficult
Electronics Forum | Sat Apr 16 13:43:53 EDT 2005 | KEN
What about electo migration? I had (what apears to be) the exact same problem you describe. X-ray and ICT fails to detect micro shorts. However, in our test, the bench functional test would show a current overload. In some cases the electro migrti
Electronics Forum | Tue Sep 01 19:31:36 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
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