Electronics Forum | Thu Sep 07 07:41:06 EDT 2006 | Bubba
Check for coplaner leads if this just exists at reflow process, i.e. look at part before oven, turn on 3D at placement machine. If you see after wave solder, the wave could cause coplanarity issues on top as well if you are going slow enough to refl
Electronics Forum | Thu Sep 07 10:45:46 EDT 2006 | vicknesh28
Yes solder is reflowing on the pad but doesnt wick up the lead. Solder paste is sufficient. It just forms a saddle like appearance beneath the failing lead. The failed lead doesnt get reflowed at all. What puzzles me is how can hundreds of leads wet
Electronics Forum | Wed Aug 09 11:59:19 EDT 2017 | dleeper
As you already know, it depends on the paste. There isn't really a rule of thumb, but less time exposed it better. The issue is the flux exposure to the air and ambient conditions. The flux can evaporate or absorb moisture from the air. If the paste
Electronics Forum | Mon Jul 31 20:34:58 EDT 2017 | zsoden
Hi all, it has been a bit of a delay but I've finally had a chance to do some further investigation on this. First off, we spend some time to clean the solder bath using Kester Solder Saver and scooped out a lot of crap. We then added about 5kg of
Electronics Forum | Tue Dec 04 10:30:16 EST 2007 | slthomas
Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in reflow? A: Yes, but somebody here don't agree with me that the glued part need help from wave to get the good wetting. They are wrong
Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1
Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Electronics Forum | Tue Jul 31 17:11:28 EDT 2007 | rpadilla
Is the via hole not supposed to be there, or is this by design? If you are trying to fill the via hole with solder and not have voiding issues, I suggest using a type 4 solder powder mesh size. Reason being, anytime you go beyond Type 4 mesh, to so
Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny
Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif
Electronics Forum | Tue Jun 27 08:38:03 EDT 2006 | cuculi54986@yahoo.com
I tried some SN100C from AIM... On only one array. It flowed well on the chips but did not like the finish on the SOT23's on the board. I did not have enough arrays to mess around, so we switched it over to SAC305 and had no issues. I'm guessing w
Electronics Forum | Thu Jun 25 16:13:05 EDT 1998 | Mike McMonagle
I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everything
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