Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Tue Sep 07 06:14:27 EDT 1999 | Earl Moon
| | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | these machines dont even offer bga selections. These machine
Electronics Forum | Tue Sep 07 22:07:56 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Sun Aug 31 07:13:13 EDT 2008 | allan99
All that they are telling is important (variants in the process), what you can do in a fast way is: change the component for a new one (date of manufacture / other supply - if you have); change the component (test - same package but other specificati
Electronics Forum | Wed Sep 10 17:12:55 EDT 2008 | gregoryyork
I dont know about analysis on boards it is OK as long as the people carrying it out know how to interogate the answers.I worked on a problem just last week where an analysis house in China tested the resist then the pads and found on both surfaces C
Electronics Forum | Wed Sep 10 14:39:30 EDT 2008 | vladig
No, we didn't do the test you mentioned, but did EDS on the joints and didn't see carbon their (which would indicate the presence of any organic-based contaminant). For the customer the issue was closed and passed to the board shop. We did work with
Electronics Forum | Wed Sep 10 14:14:03 EDT 2008 | gregoryyork
Yes why did the Electroless Nickel layer split this is the ROOT cause. My guess is still that the resist was slightly miss registered over the copper and therefore poor adhesion of the Nickel ensued OR like I said originally the resist had contaminat
Electronics Forum | Tue Apr 27 08:14:59 EDT 2004 | iqbal
Is anybody doing BGA soldering water clean solder. If yes how you are ensure cleaness. We have boards with Four BGA and 2000 chip and ICs.We are processing with no clean solder but we are getting bad wetting so now we are planning to switch to water
Electronics Forum | Wed Apr 28 22:35:32 EDT 2004 | davef
We can clean the blank out of LARGE BGA. [Cleaning small BGA is a whoooole nuther issue.] But before we get into that, what's the problem and its breadth? Why are you getting poor wetting? What's the story on the components, board, process materia
Electronics Forum | Thu Jan 02 11:35:30 EST 2003 | Richard
Cleanliness test � �Area Grid Arrays�. Evaluation of residues� resistivity in a specific location on the board. (As compared to �Solvent Extract� evaluation.) We are: SMT assembly, using standard �water soluble� process with micro BGAs (example: C
