Electronics Forum | Wed Jun 18 18:58:10 EDT 2014 | ke6zoy
Hi All, We leadform components for our assemblies in house and have been tinning the leads using a dip methood by hand into a solder pot. by just handling the components during the tinning and cleaning process we are at times damaging the parts/lea
Electronics Forum | Wed Jun 25 09:51:51 EDT 2014 | iam09
Hi Sirs, We are running Tin Lead process and we have boards that required clean and no clean process which have different flux application in our wave process. We are looking into opportunity to use common flux system for both clean and no clean an
Electronics Forum | Wed Jul 16 14:13:17 EDT 2014 | alexeis
Hi, If you can not rely on your programmer and the tools he uses then "double checking" can save you only materials but in time you really do not save often extend meaning. There are things you can identify before the stove, but if you use tools li
Electronics Forum | Fri Jul 18 03:21:59 EDT 2014 | skipbruce
Hello June The following infomationI find from net for you reference. OSP (Organic Solderability Preservative) 1)Preserves copper surface from oxidation until asse mbly. 2) Very thin coating (100-4000 Angstroms). 3)Applied in a vertical (dip tank
Electronics Forum | Thu Jul 31 14:58:06 EDT 2014 | rgduval
If it has been determined that it is definitely the relays (and not some other circuit device), you'll want to get the vendor/manufacturer involved for some failure analysis. They'll cut open the components, and try to figure out what's going on in
Electronics Forum | Wed Jul 30 00:47:10 EDT 2014 | matusov
Hello gurus, I am a hardware designer with a small company. We are about to send a new PCB for fabrication. This board uses dozens of tiny QFN, DFN, and similar packages. As a final check I have been going through the datasheets of all these parts t
Electronics Forum | Thu Sep 04 03:26:18 EDT 2014 | eurekadrytech
Hi all: Interesting question you have raised as it concerns the rate of absorption by the board material. I represent http://www.EurekaDrytech.com and could assist in resolving the blistering problems you're facing. First some questions. 1. Is the
Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech
Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro
Electronics Forum | Sun Sep 07 13:33:50 EDT 2014 | horchak
Edri PCBA design and pad geometry is one of the critical factors for BGAs. Typically the pad size for collapsible balls is 80% of the ball diameter. Pad size consistency is critical. In your situation what will happen the larger pads will wick the s
Electronics Forum | Sun Oct 19 06:42:01 EDT 2014 | timbo292832
im designing a circuit that will require the use of a edge connector so it can connect to another circuit. i need to do this so i can get both micro controllers communicating i have done a bit of research and am thinking about using a pcb manufact
