Electronics Forum | Tue Apr 04 12:44:08 EDT 2006 | Andrew
Anyone knows if there are some issues when you solder Silver finish components on Ni-Au finish pads with Sn/Pb/Ag solder paste (Indium)? (I must use components with silver finish) Thanks
Electronics Forum | Thu Apr 13 07:18:47 EDT 2006 | Charles
It will be hard to solder metal that finish by any coating. So you should remove the coating first. You need strong acid to remove coating. After you solder both then you can silder finish esay.
Electronics Forum | Wed Apr 05 20:52:51 EDT 2006 | davef
If you let the silver content of your solder connections get much above 3 percent, it could cause reliabilitility problems, similar to the problems caused when the gold content gets too high.
Electronics Forum | Fri Feb 19 02:11:11 EST 1999 | Pete Sorenson
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Fri Feb 19 09:14:52 EST 1999 | Justin Medernach
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Wed Sep 05 08:50:04 EDT 2001 | davef
No arument with others comments about moisture, but taking a different tact, consider that the volitle elements of the solder paste disppear as a function of the amount of time the paste is out of the container. [Maybe as a function of solder paste
Electronics Forum | Tue Sep 04 11:09:25 EDT 2001 | blnorman
As the others have stated, moisture is the killer. You have to be sure no moisture is allowed to get to the paste. If it does, you'll get solderballs. I would suggest not using a vacuum. The solvents and other volatile components of the flux will
Electronics Forum | Tue Sep 04 09:12:35 EDT 2001 | caldon
Moisture would be my main concern. Even though components are plastic, they can absorb moisture. Moisture is also detrimental to the the solder itself. The water droplets that are left behind (evaporated even) could cause problems (i.e. chlorides).
Electronics Forum | Mon Sep 03 08:56:26 EDT 2001 | henriksn
Hi everyone, I work in a development firm, that has a small prototype department. We have recently invested in a small automatic SMD pick&place machine. When mounting over 100 different components, the machine runs out of feedercapacity, and the res
Electronics Forum | Tue Mar 06 18:34:59 EST 2007 | GS
It may be to much solder paste under components. Try different paste doposit schape or thikness Regards....GS
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