Electronics Forum | Wed Mar 10 13:13:19 EST 2004 | davef
It's [maybe], because you melt [reflow] the itty, bitty solder pellets [that were formed from a liquid solder] in the solder paste. * Wave solder is melted solder bars [that were formed from a liquid solder], also, but someone named it wave soldering
Electronics Forum | Tue Oct 28 09:24:10 EST 2003 | davef
Running a soldered BGA through a wave solder pot is very risky: * 230-240*C temperature of the pot could damage the device. * Solder in the pot will certainly cause bridging between BGA solder balls. * Solder in the pot could melt BGA solder balls.
Electronics Forum | Mon Oct 23 21:18:14 EDT 2000 | Dave F
Unlike components where the solder paste has been reflow soldered, wave soldered components have an "infinite" amount of solder available to make a solder connection. If you have good solder flow, pad and component termination size are going to be b
Electronics Forum | Thu Jul 06 03:43:22 EDT 2017 | jamesbarnhart
Electronic devices required higher speed, I/O capability, and density to meet standard requirements. Automated robotic soldering solutions that meet the demands of applications are too challenging for hand soldering. Manual soldering, even with the m
Electronics Forum | Thu Jul 18 21:00:57 EDT 2002 | davef
Platitudes about soldering are: * People ARE NOT good at soldering. * Machines ARE good at soldering. You can purchase a good used wave soldering machine for $20k. * Training helps people to be better at soldering. * Your solder connections should
Electronics Forum | Mon Oct 01 16:55:27 EDT 2001 | davef
I agree. Poor soldering technique is the most straightward way of creating solder balls during hand soldering operations.
Electronics Forum | Fri Nov 10 16:09:18 EST 2006 | realchunks
When you say "Displacement Soldering" do you mean selective soldering? Also known as spot soldering?
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Electronics Forum | Mon Nov 17 14:14:15 EST 2003 | blnorman
The main function of the test is to evaluate the solder mask. Basically you are testing three samples: #1 - No solder mask, #2 - solder mask without solder, and #3 solder mask with solder. The solder pot is used to apply solder to the patterns on O
Electronics Forum | Wed Jan 07 07:16:25 EST 2004 | davef
Cold solder prior to properly performing a well designed drop test. Actually, "cold solder" means different things to different people. Two dull solder connection conditions are: * "Disturbed" solder joint: a solder joint that has an "angular face
