Electronics Forum | Thu May 01 18:37:31 EDT 2003 | gregoryyork
Did you get any dulling of the solder joints at all or importantly was the resist discoloured or bleached after cleaning. It is possible to absorb flux and saponifier into the resist and this will definately cause poor SIR or electromigration especia
Electronics Forum | Wed May 07 09:02:29 EDT 2003 | cyber_wolf
I was wondering if anyone has done a study on thermo couple attachment with light cure adhesive.I have read all the papers and articles about aluminum tape, Kapton, and high temp solder.I have yet to hear anything regarding the accuracy of light cure
Electronics Forum | Mon May 19 02:59:04 EDT 2003 | emeto
Hi, I can give you a few steps. 1. The solder paste. Take the profile that manifacturer gives for the paste. 2. Use termocouple to measure the tempereture. Put PCB and measure the temperature in equal terms. 3. Compare your profile to manifacturers
Electronics Forum | Fri Sep 12 22:57:13 EDT 2003 | Dean
What is the surface finish of the PCB? Tin? Imersion Silver? What flux is used in wave solder and / or SMT? I have much experience with silver migration and tin wiskers. Both can disappear during a reqork cycle. Both can be extremely difficult
Electronics Forum | Sat May 24 00:43:59 EDT 2003 | iman
Our engineers did a study on our medical product with 1mils standoff height, and one issue was 100% of the boards that underwent ultrasonic failed due to failure of the package wirebonding. Poor reflow control would be one area to review in any event
Electronics Forum | Tue Jun 03 06:29:43 EDT 2003 | mk
Orrrrrr, you could eliminate the printing, shorting, and special surface finishes by bringing the boards in with the paste already on them. There is a process that is a much more forgiving method for applying paste called solid solder deposit. Check
Electronics Forum | Fri Jun 06 07:34:43 EDT 2003 | johnw
Rick, my understanding is that the US do not have plan's fr lead free legislation. However the European legislation states that any product entering the european market after June 2006 must meet the lead free std's of the directive. So basically if
Electronics Forum | Wed Jun 04 09:15:06 EDT 2003 | davef
We used to use 260+-5C (500+-10F) for Sn63, now we use 240-260C (460-480 F). You probably could get away with 232C (450F) in all cases, since there is no thermal mass to a lead being tinned. We keep our tinning temperature the same as our solder po
Electronics Forum | Fri Jun 06 22:10:11 EDT 2003 | MA/NY DDave
Hi John I believe gave a good answer with cautions. The .001 or .1% is the main criteria that internationally means you are Lead-free per JEITA, the EU and NEMI. They sat around at a table and decided is how they got the .1% John did note that yo
Electronics Forum | Wed Jun 11 16:55:16 EDT 2003 | MA/NY DDave
Hi Yes Thanks, I understand that there are still some arguments going on in the EU and some companies like Phillips AG, I believe, are championing changes. Even so from what I know the combined JEITA/European (Soldertec) /USA NEMI task group is sti
