Electronics Forum | Fri Nov 22 08:59:49 EST 2002 | ksfacinelli
I would have to agree with the to high temp being a real problem. I have seen this with the WS-609 alpha paste. If you run it up to high in temp. The joints appear to be cold but they are really just over fried.....definitely try reducing temperat
Electronics Forum | Fri Nov 22 17:55:39 EST 2002 | robertorre
Your problem may be related to different aspects. 1. Oxidation on landing pads. 2. Either high(To long over liquidous temp) or low temp. 3. Bad solder (not enough vehicles) Run this test: Set a hot plate to 220 degrees C. Make sure you have proper ve
Electronics Forum | Thu Jun 09 09:10:56 EDT 2005 | russ
I think I would work on the reflow profile or your paste handling procedures to prevent the splattering. I might even change paste suppliers or formulations.
Electronics Forum | Tue Apr 22 02:27:38 EDT 2008 | fowlerchang
Many factors will make tombstone happen. from design/stencil aperture/soler paste/placement/reflow and so on. here is one article about tombstone which I prepared long ago. send me your email if you need it.
Electronics Forum | Sat Jan 25 20:17:40 EST 2003 | ramanandkini
We are soldering a 8 pin TTL chip on to a CEM1 board that has a hot air level soldering. We use no clean soler paste for the reflow process. Now the customer wants us to clean since he is afraid of flux attracting the dust. We have some SMT LEDs that
Electronics Forum | Thu Jun 09 03:16:06 EDT 2005 | PSGill
I'm using Kester R520A Lead free solder paste. The flux % stated on the Certificate of Analysis(COA) when the product delivered to us is 10 %. The tolerance is 1%. But when i send the jar to an external lab to determine the flux % it is more than 11%
Electronics Forum | Fri Jun 18 20:09:52 EDT 1999 | Dean
| Has there anyone bold enough to try this in their shops? My cubemate just got through telling me that at his last shop, they had bare copper boards (no HASL, no OSP, no nothing), with minimal solderability problems. | yes, 8 years ago I developed
Electronics Forum | Fri Apr 19 08:19:26 EDT 2002 | jnunns
If the solder balls are next to your discretes, you should consider a homeplate design on you stencil apertures. THe only other time we have seen soler balls is due to the raw card. If the vias are not plugged by the solder mask, solder and air can g
Electronics Forum | Fri Oct 02 11:23:08 EDT 2009 | floydf
Does anyone out there have experience soldering > with Pb solder (Sn 63 or Sn 62) to SAC 305 coated > PCB lands (about 50um) or Sn-Cu plated lands > (about 10um). I know soldering Pb free (Sac based > soler) to Pb/Sn coated lands is a no-no, but
Electronics Forum | Wed Sep 08 22:49:38 EDT 1999 | Jason Tomlinson
| | I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be done?
