Electronics Forum | Tue Oct 10 08:51:26 EDT 2000 | John
Thanks for the responses, and I tend to agree. I would much rather go through a more structured continuous improvment process (set goals, meet them, set new goals and so on). Our company is rather small and made the jump from all through hole to mi
Electronics Forum | Fri Dec 22 16:04:26 EST 2006 | mika
Hi, This Not so easy as one wuold think. Has the thermal pad of yours vias? How many? What's the via's dia? What is the pcb thickness? If the the pcb has a "ground layer" connected (vias) to the pcb thermal pad, it could sometimes be a little bit tri
| 1 |
.gif)
winsouce.jpg)