Electronics Forum | Thu Aug 21 23:35:20 EDT 2003 | kennyg
For ICT purposes I may need to print solder paste on 0.015" test vias. No-clean is not an option for this assembly and OA seems the only choice. Can flux be safely removed from inside the via from the other side during a standard water wash process
Electronics Forum | Wed Feb 11 00:34:42 EST 2015 | comatose
There isn't going to be much worthwhile used equipment out there if you mean true jetting - it is a pretty recent process. There are lots of used stencil printers out there, so from an up-front cost perspective, stencil wins. Jetting is slow. A hig
Electronics Forum | Tue Jan 06 16:31:41 EST 2015 | jacklucas
In switching to lead free processing, we find ourselves having over 400 PCB part numbers with Sn63 HASL finish. And there is no hope of quickly purging inventory and getting our drawings changed to call out a lead free finish. I want to avoid having
Electronics Forum | Tue Jul 19 09:18:14 EDT 2011 | davef
Could this be an opportunity to explore the use of cartridge-type paste dispensers? Or maybe a reason to keep working over the weekend. * Re-Storing & Re-Using “Used” Solder Paste. Though not a recommended practice, used solder paste from the stenci
Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef
We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which
Electronics Forum | Tue Dec 23 09:13:12 EST 2014 | jeff701
I'm in a manufacturing environment with a very high mix of boards, and some low-mid volume. A "large" production run might consist of 100 boards. Volume: There are numerous boards that have a volume of 1-3 pieces. There are a few boards with an annua
Electronics Forum | Tue Jul 08 18:53:21 EDT 2003 | MA/NY DDave
Hi The answer in general is no mixing of Lead Free with Sn/Pb solder. If you look at reliability data, failures after stress tests and then SEMs, failures occur at grain boundaries inside the joint. Lots more happens. By the way this mixing happe
Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef
Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-
Electronics Forum | Tue Jan 16 01:22:35 EST 2007 | samsim
Hi Stephen, Q2) As per my understanding, no solder paste supplier or any organisation provide Mixing standard or ratio as it is not recommanded. However, I do know that some company, they allow mixing of old and new solder paste (as solder paste is
Electronics Forum | Fri Feb 23 09:35:36 EST 2024 | emanuel
We have the standard profile as a template made according to the solder paste specs. For some boards we measure the result at 2 points, on the board itself and on top of a sensitive SOT263 module and adjust accordingly. The solder paste is well kept,
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