Electronics Forum: stencil (Page 226 of 572)

Re: STENCILS

Electronics Forum | Mon Jun 29 13:50:48 EDT 1998 | Russ Miculich

| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU

Re: Any success using metal squeegees w/Fuji GSPII?

Electronics Forum | Fri Feb 20 14:16:06 EST 1998 | Dave McFadyen

I've been using metal blades on several brands of printers over the past few years and have to agree with comments in other replies. Contact print is a must or you will tear slits in your stencils at the ends of the blade. Center-mounted (floating) s

MPM Print Parameters

Electronics Forum | Wed Aug 15 18:48:58 EDT 2001 | mparker

I would consider the fab placement in the printer to be of more concern than the pro's and con's of a single foil for top and bottom print. Do to the larger size of the fab you will have to align the top and bottom layers sequentially on the foil. O

Fine pitch paste release problems.

Electronics Forum | Tue Dec 17 20:25:13 EST 2002 | iman

Check : 1) design aspect ratio / are ratio required to fabricate the stencil you r using. 2) check if the stencil maker is using your checked aspect ratio / area ratio? if not the same, what are they using? any QA report confirming actual dimension

Stencil cleaner

Electronics Forum | Wed Feb 26 13:15:52 EST 2003 | Mike Konrad

The specific answer depends on what your specific application includes. #1: What are you removing? (solder paste, adhesives) #2: What are you cleaning? (stencils, screens, misprints, pallets) #3: What type of machine are you using? (Spray-in

Naming Files

Electronics Forum | Tue Jul 01 18:36:06 EDT 2003 | Matt Kehoe

I am trying to get opinions about a situation that we are discussing with a vendor/customer. While not a technical issue it has caused some confusion and I need some opinions to help settle the debate. We are a service bureau who receives stencil fi

Sudden paste release problem

Electronics Forum | Wed Feb 09 21:41:49 EST 2005 | Grant

Hi, We have been running the same stencils for about a year, 5 thou thick, 1-mm pitch BGA's and every-things been ok, but then suddenly over the last week, 2 different products have had paste release issues with the BGA. It's odd because nothings c

Tombstoning issues!!!

Electronics Forum | Mon Apr 14 19:26:35 EDT 2008 | diesel_1t

Update: Recently, we ran a (old) product on which they made a new stencil, appertures 1-1 on 0603. As soon as they began to run, tombstones appear. I went to trashcan to rescue old stencil, and noticed that pads came with a "c" shape reduction, I as

LGa soldering issues......

Electronics Forum | Wed Aug 26 12:06:44 EDT 2009 | clampron

Good Morning, I have been struggling with this part for some time now. I have to agree that whoever designed this part, did not have to manufacture with it. We have advanced to a point where they have a acceptable yield but I believe that will be hi

Aligning camera on the MPM AP25

Electronics Forum | Sun Sep 25 20:20:22 EDT 2011 | johnyq

We recently aquired an old MPM-AP25 stencil printer that printed paste with a large error (about .060 inches). I concluded camera alignment to be the cause but was surprised by the magnitude. I found the camera beam splitter prism misaligned and loos


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