Electronics Forum | Wed Apr 26 06:51:11 EDT 2023 | poly
I'm looking to make dedicated tooling for my mpm stencil printer. We only make 3 different boards and they are the same size panel so I'm planning to make one bit of tooling for them. One board is 0.6 mm and sometimes I have problems with it not bein
Electronics Forum | Wed Apr 26 19:10:43 EDT 2023 | cyber_wolf
This machines support table looks similar to AP and UP machines. I believe MPM published the dimensions of the "H" tower that the dedicated plates bolts to. As far as the plate, they are typically (2) pieces with the inside hollowed out to allow for
Electronics Forum | Thu May 01 13:56:45 EDT 2003 | kmorris
Dave: After the stencil was made with apertures for a connector on this PCB, it was discovered that the connector would have to be handsoldered after SMT reflow. If the solder deposits are left to reflow on the pads, it makes it difficult for the o
Electronics Forum | Mon Apr 28 09:53:10 EDT 2003 | kmorris
I've got a set of apertures on a stencil that I would like to "plug" or block off. In the past we've done this with Kapton tape, but since this location is close to a fine pitch component, the thickness of the tape prevents good gasketing at the fin
Electronics Forum | Thu Sep 24 19:54:40 EDT 1998 | S. Evers
| I am looking for anyone out there that has had experience with stenciling with chipbonder adhesives. I need information on material and stencil design. The firm who can help is K&J marketing their new KEPOCH stencil material is a (plastic) polyimi
Electronics Forum | Fri Sep 25 12:53:25 EDT 1998 | Bill Schreiber
Regarding cleaning Chipbonder adhesives from stencils and misprinted PCBs. Check out the Smart Sonic Stencil Cleaning Process at: www.smartsonic.com | | I am looking for anyone out there that has had experience with stenciling with chipbonder adhe
Electronics Forum | Tue Feb 25 11:56:33 EST 2020 | slthomas
I think I'd opt for a stencil with everything already cut and then tape it if that didn't screw up your stencil gasketing. Then you just have to define the process for adding the optional parts and you can decide to use those apertures or not.
Electronics Forum | Wed Sep 18 19:43:12 EDT 2002 | dragonslayr
One more variable I've remembered - pad height with respect to solder mask height. Pads being too low can cause stencil "gasketing" problems that in turn allow more paste to be deposited than needed. Are your fabs HASL or some other media?
Electronics Forum | Thu Jun 15 09:58:12 EDT 2006 | slthomas
Just to add to what dave said, the only limitation to how frequently you clean is the cost of the cleaning medium. You can wipe every board if you want to, but you'll go through material accordingly. If you're printing 16mil pitch or smaller, cleani
Electronics Forum | Wed Sep 21 15:49:45 EDT 2022 | markhoch
I agree. The silkscreen will cause a gasketing issue with the stencil.
