Electronics Forum | Fri Apr 16 04:19:28 EDT 2004 | denis_s
Hi, I've a problem with a BGA. I've the impression that the balls broke then there is a too big mecanical stress on the PCB. I lost some dBm and when I press on the BGA I measure the good value! It's like the balls are take off the BGA or PCB and wh
Electronics Forum | Fri Apr 16 10:42:04 EDT 2004 | davef
Possibilities are: * Handling problems, like Bob L [the previous poster in this thread] mentioned. * Poor reflow recipe selection. Search the SMTnet Archives for previous discussion. [Your English is fine. Most of us "English" writers don't do any
Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Thu Sep 12 11:26:11 EDT 2002 | scottefiske
CK, If joints have been validated prior to ICT (under BGA Scope), more often than not repeatable joint fractures are due to undo stress being placed on the component during ICT test. Verify ICT probes and fixture. If after proving out fixture/pin com
Electronics Forum | Tue Feb 05 09:19:27 EST 2002 | Carol Stirling
Would someone be able to direct me to information on residual BGA stress please? I've been told that mounting the BGA involves residual stress to the solder balls due to different expansion characteristics of the BGA versus the board at the moment of
Electronics Forum | Tue Feb 05 22:19:52 EST 2002 | davef
Residual stress is not limited to BGA balls. I have residual stress. It does not leave until I start singing Led Zepplin songs at the top of my lungs. And for that to start, I need a good hour of staring at the bottom of a frosty mug at Jimbo's Lo
Electronics Forum | Tue Oct 15 13:35:57 EDT 2002 | Chris Dill
Stress analysis on a component is available ECT (fixture house) Feel free to contact me @ (401)739-7320 x3337 for info. Chris
Electronics Forum | Mon Jul 23 14:39:11 EDT 2012 | hegemon
I would think that wave solder beneath a BGA component might be a little bit stressful. The board will be expanding much faster than the BGA on the topside. This will cause some stress to the solder joints that might show up as the failure you are
Electronics Forum | Sat Apr 10 01:11:37 EDT 1999 | forest
Our company is going to use BGA(1.27mm pitch) But I have heard of troubles with P-BGA. It is that cracks occured between solderball and gold plating of PCB during ICT(incircuit test). We know that gold plating of PWB is not good for BGA, so we decide
Electronics Forum | Tue May 05 21:17:46 EDT 2015 | warwolf
So, im tasked to outline that the centre of a 28cm x 20cm PCB has the most susceptible stresses in the centre, my reson is to avoid putting the BGA there. I had a really good article outlining this but I carnt find it. can anyone help?
