Electronics Forum | Sun Feb 23 14:32:42 EST 2003 | davef
Sources of sulphur in PCB fabrication are: * Some locales have high H2S concentrations in the air. * Metal etching steps that use sulfuric acid or a sulfonated buffering compound may result in sulfate residues. * Sulfates can come from contact with
Electronics Forum | Wed Feb 22 08:31:42 EST 2006 | davef
Q1 Are there any standard regulating the subject? Very few infos found on IPC. A1 We�re unaware of standards for packing and storage for most types of boards. * IPC 4553 standard for Immersion Silver Finish, 3.8 Packing and Storage. * J-STD-033 and E
Electronics Forum | Tue May 21 20:27:05 EDT 2002 | davef
No N2. We could not fix a benefit for N2 in our minds. Just fold the excess bag material over to expell most air and then seal the bag. [Have you assessed the benefit of N2?] F Monette can tell you stories about little versus more pressure. If he
Electronics Forum | Fri May 21 15:20:26 EDT 1999 | JohnW
| I normally handle the soldering issues for this facility but a question was asked of me -- What the H@## is this stuff and what is causing it? Was wondering of I could get some input from any Guru on plating issues. Need info ASAP!!!!!!!!!!!!!!!!!
Electronics Forum | Fri Jan 11 17:14:13 EST 2002 | davef
We have one product with electroless nickel, immersion silver solderability protection. We do not purport to be experts, but like many things, have seemingly boundless opinions. Side note: There are a least three different [maybe five] imm silver
Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef
We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition
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