Electronics Forum | Thu Jul 26 17:43:57 EDT 2007 | tphan
Board had a via hole underneath of the solder pad of the BGA. When it run through reflow oven, it caused a lot of void. How to correct this issue?
Electronics Forum | Tue Jul 31 17:11:28 EDT 2007 | rpadilla
Is the via hole not supposed to be there, or is this by design? If you are trying to fill the via hole with solder and not have voiding issues, I suggest using a type 4 solder powder mesh size. Reason being, anytime you go beyond Type 4 mesh, to so
Electronics Forum | Tue Jul 31 18:33:53 EDT 2007 | mattkehoe
http://www.sipad.com/sipad_vip.htm
Electronics Forum | Thu Jul 26 22:52:56 EDT 2007 | davef
Choices are: * Respin the board to move the via so that it is no longer under the pad. * Have the board fabricator plug and plate over the via. Search the fine SMTnet Archives for background.
Electronics Forum | Fri Jun 09 08:17:07 EDT 2006 | amol_kane
did you look at the pad vs the stencil design? are you putting down enough solder paste on the pads? what are your reduction ratios for these packages?
Electronics Forum | Tue Aug 01 11:30:11 EDT 2006 | heyitech
We need to sold compnents on the copper board(1.5mm thick)by using lead free solder paste. please give me some suggestion if you have experiences on this issue. thank and regards
Electronics Forum | Fri Jun 09 15:41:59 EDT 2006 | shawnvike
That is the problem I am having! Except with 3 separate manufacturers. To answer some of the other questions... Baking - diligence Stencil - as far as we can tell it is good Placement is good We are using Pb-free parts and solder, but I have see
Electronics Forum | Fri Jun 09 05:18:07 EDT 2006 | Rob
Hi Shawn, that you're baking the components makes me think that they are either old, or have been sitting around for a while (or none of the above & you are really dilligent!) Whilst baking will sort out the MSD issues (such as popcorning) it will
Electronics Forum | Tue Jun 13 17:40:16 EDT 2006 | slthomas
"Which processes are out of control here?" Forum moderation?
Electronics Forum | Tue Aug 01 16:30:11 EDT 2006 | russ
What are you looking for? Follow the MFGR spec for paste and reflow info.
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