Electronics Forum | Fri Nov 25 20:57:30 EST 2016 | sarason
You guessed right. Not hot enough to get good reflow. regards sarason
Electronics Forum | Sat Nov 26 00:56:17 EST 2016 | slavek
thank you sarason
Electronics Forum | Fri Nov 25 05:16:44 EST 2016 | slavek
Hello, I want to ask on suitable temperature profile for PCBs with ENIG final surface finish. I know that it is complex question with many unknowns. When the PCB will be standard 1,5 mm 35/35 Cu and the amount of components will have any influence o
Electronics Forum | Mon Jul 29 19:21:58 EDT 2002 | davef
Look to: * Your flux supplier's recommendations to baseline your recipe [similar to using your paste supplier's recommendations for setting your reflow recipe] * 7530 'Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)' for gui
Electronics Forum | Sun Jun 06 11:01:36 EDT 2004 | adm
Hi I'm trying to plot a LSP profile to reduce void. But I do not have much info about LSP. Does anyone know what are the specific times and temperature of the LSP profile? And are there any ways to eliminate solder void other than changing profile
Electronics Forum | Sun Jun 06 11:02:33 EDT 2004 | adm
Hi I'm trying to plot a LSP profile to reduce void. But I do not have much info about LSP. Does anyone know what are the specific times and temperature of the LSP profile? And are there any ways to eliminate solder void other than changing profile
Electronics Forum | Sun Apr 25 09:45:13 EDT 1999 | Joe Cameron
Hello all, Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized profile can
Electronics Forum | Fri Sep 21 11:02:37 EDT 2001 | davef
You can measure temperatures any place that you would like, but the issue is the temperature of the solder. We've seen solder temperatures that vary from lead to lead on the same component. Why don't you want to measure the temperature of your so
Electronics Forum | Thu Jun 08 04:31:24 EDT 2006 | vasily
Hi First I think you have to analize your PCB design. Heavy weight components should be gathered on one side of PCB. As I think, if you want to reflow both sides simultaneously there might be a problem. A chance that large components will drop off
Electronics Forum | Fri Mar 28 04:57:41 EST 2003 | emeto
more heat.But that's not correct!If convection there are air flaws and bare board has lower temperature than a board with high density.When you have elements on board you hava a vortex and the air flaw invreases the temperature.
