Electronics Forum | Wed Jun 08 17:35:04 EDT 2016 | slthomas
We all know that whenever possible, we want thermal relief between the barrel/pad and the copper foil to make it easier to properly solder that through hole connector. My question is, assuming there is no connection from the barrel to a copper layer
Electronics Forum | Sat Jun 11 07:51:15 EDT 2016 | davef
Hi Steve ... There are arguments between fabricators and thermal relievers about adding non-connected copper tabs to barrels in hopes of providing thermal relief, but that's not what you're talking about, I believe. I don't foresee an issue moving t
Electronics Forum | Thu Jun 16 16:34:59 EDT 2016 | slthomas
Hi Dave, I'll ask them if they consider it on the next spin....can't see any reason it would have any negative effects. Thanks! Steve
Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Tue Feb 18 19:07:21 EST 2003 | arturoflores
Our case is not due to thermal pad print squeezing because our shorts are mostly in the outer rows of the BGA so they cannot be caused by central pad printing. We still stick to the BGA thermal pad coplanarity/height hypothesis but have not yet prove
Electronics Forum | Fri Dec 27 09:45:04 EST 2002 | emeto
what exactly do you mean by big thermal pad?
Electronics Forum | Fri Dec 27 10:04:56 EST 2002 | haran
Big pad located at the middle of the package. On the PCB,we need to have solder paste printed on the thermal pad which is at the middle and the other pads of the perimeter BGA.
Electronics Forum | Tue Feb 18 22:15:04 EST 2003 | davef
Arturo, So, you're not shorting to a thermal pad. Given that you're shorting to outer balls, tell us about: * Location of the shorting among the outer balls. * Board construction. * BGA constuction. * Paste deposition. * Temperature measurements ta
Electronics Forum | Fri Dec 27 01:30:13 EST 2002 | haran
Currently we are running a BGA with a big thermal pad in the middle of the package and encountered high defect of solder shorts.I would like to check whether anyone has experience this problem and how this can be rectified?.
Electronics Forum | Sat Dec 28 02:58:12 EST 2002 | emeto
If the problem is in the big thermal pad.The surface strains in that pad are different then the others and through the reflow period there is an affinity between them(only if they are too close). I recommend you to reduce the theramal pad. Make smal
.gif)
