Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Wed Dec 31 10:09:27 EST 1997 | Ken Daniels
| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe
Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca
Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint
Electronics Forum | Tue Nov 18 11:35:43 EST 2003 | John
Does IPC list a specification that describes the acceptable thermal stress capabililty of components? I seem to recall something about dipping at 260C for 10 seconds, but I can't find the reference. Also seem to remember descriptions of the allowab
Electronics Forum | Fri Dec 30 11:54:53 EST 2005 | John S.
Seen cap cracking before. It can be caused by thermal stress as noted above, but don't discount mechanical stress and handling. Your depanelization method is a strong candidate. We applied strain gages to baords and benchmarked various mechanical
Electronics Forum | Thu Jun 06 12:54:23 EDT 2013 | emeto
I think that you will be fine. You don't want to crack the part during it's stay on a high temperature in the reflow oven(thermal shock...thermal stress...). Once you mount the part on the board it will collect moisture again, but it is already proce
Electronics Forum | Wed Jun 13 21:31:27 EDT 2001 | davef
Lotsa ways to bust caps. First: placement force; Second: thermal stress; Third: poor pad design. Forth: then, ummm maybe the cap supplier. Please describe the crack in more detail. Where does the crack start? Where does the crack go?
Electronics Forum | Wed Jan 26 07:55:17 EST 2000 | Dave F
Mikel: There's a lot of ways to break a glass diode. Poor material handling High placement force Thermal stress Board flex So, where is this damage occuring? Dave F
Electronics Forum | Fri Apr 17 07:45:43 EDT 1998 | Robert Meston
We have to mount our SMD devices 0.1 to 0.4 mm off the pcb PCb substrate to compensate for thermal stressing in a Space enviroment. Has any one any ideas or contacts for dissolvable pads. this only applies to leadless components
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