Electronics Forum | Tue Oct 07 08:38:05 EDT 2003 | davef
J-STD-001C requires removal of gold from (through-hole) component leads when the thickness of the gold layer is above 2.5 microns to prevent problems with embrittlement. The thickness of gold on an ENIG board typically is around 0.05 micron, resultin
Electronics Forum | Wed May 17 20:37:08 EDT 2000 | Steve
At our facility, we process FR-4 boards for PCMCIA cards (0.020"). The key for us is dedicated fixturing for stencil printing and fixturing for reflow soldering. We are working closely with our customer to better improve panel design, but other than
Electronics Forum | Tue Dec 10 13:35:34 EST 2019 | scotceltic
I am looking to see what people are using for a min-max range to supply your PCB fabricators regarding solder mask thickness. I saw some points in the archives but not too much regarding what people are providing as their spec ? Any help would be a
Electronics Forum | Tue Sep 16 10:58:03 EDT 2003 | swagner
I am currently having a discussion with a pcb supplier about inadequate hasl thickness, we are measuring below 40 microinches of hasl when our spec calls for 100 microinches as the minimum. Our supplier came back with the statement the entire indust
Electronics Forum | Mon Apr 09 10:38:26 EDT 2001 | bobbemc
Design parameters are based on tallest components on the bottom side of the PCB. The smallet the component the thinner the floor thickness can be.
Electronics Forum | Mon May 20 12:01:37 EDT 2019 | gregoireg
I have a PCBA job which has on the top side a few standard QFN components (0.4mm pitch) and a big module (35mmx60mm) with 1.13mm BGA pads: https://imgur.com/a/YUGgejW To be clear, this module is composed of a PCB with some components on top and some
Electronics Forum | Wed Dec 11 12:07:33 EST 2019 | scotceltic
Our company has a spec on their current PCB dwg to make sure the fab house meets a specific thickness (min-max). The current spec reads: 13.5um min - 38.5um max. I assume it is to keep the board house honest and to make sure there is no exposed co
Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
Electronics Forum | Tue Jun 07 08:31:57 EDT 2011 | bootstrap
I am building a rugged digital video camera product that essentially is just a sandwitch of 3 parts: #1: front piece is machined aluminum with C-mount thread #2: middle piece is 1/16" printed circuit board #3: back piece is machined aluminum The
Electronics Forum | Wed Jan 13 04:27:00 EST 2016 | crystalpcb
Hi Here is our factory production capability: Shenze Electronic PCB Specification Layer Count 1 to 35 Layers Material Brand Shengyi,KB,GRACE,ISOLA,Rogers,Taconic,ARLLON,Bergquist Base Material FR-4（TG135,TG150,TG170,TG180），Halogen Free FR-4，Ceramic
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