Electronics Forum: thread (Page 6418 of 7902)

Re: Underfilled CSP mechanical test

Electronics Forum | Mon Jun 19 21:32:15 EDT 2000 | Dave F

Frank: Good luck on finding a specification. The right combination of material properties will greatly improve the lifetime of your flip chip component. Your flip chip supplier might be best starting place to determine underfill properties that ma

Re: Curing of Glue for SMT Components

Electronics Forum | Thu Jun 15 22:06:15 EDT 2000 | Dreamsniper

Hi Raeto, 1. You do not have reflow oven. This means that you are not running Surface Mount Technology in your shop floor...am I correct? Why do you plan to have SMD's under your PCB's ? Can't you replace them with their PTH counter part and have th

Re: Curing of Glue for SMT Components

Electronics Forum | Sat Jun 17 09:09:15 EDT 2000 | Chrys Shea

Contact the adhesive manufacturer, or their website. Most adhesive suppliers offer two cure options - one with a belt oven profile and one with a box oven profile. The belt oven is usually a ramp and plateau of 120-150C for approx 2 minutes. The b

Re: Fuji CP6 nozzle reflective disks

Electronics Forum | Thu Jun 15 14:20:21 EDT 2000 | Kevin Simpson

Hi Peter, The Disk you are refering to can be outsourced from several different vendors. The thing to be careful with is getting a consistant colored disk. You don't want to have etc... some dull/bright..etc. We have found one local vendor we use.

Re: Soldermask Design Rules

Electronics Forum | Thu Jun 15 12:57:12 EDT 2000 | Dave F

0.0006" LT Total pad height = Thickness of ( Copper pad + OSP ) = 0.0014" + 0.00000157" = ~0.0014" (You must be using an organic solderability preservative (OSP) or Electroless Nickel immersion gold (ENIG) because 0.003" tin/lead or white tin would

Re: OnBoard Forum

Electronics Forum | Tue Jun 13 14:14:40 EDT 2000 | Deon Nungaray

Dear Mr. Cunli, I think it would be useful to have the ability to access the archives easily. However, I do have a comment on your home page format. In the past the SMT Forum entries were viewed on the top middle upper section of your home page and

wave solder

Electronics Forum | Mon Jun 12 10:57:51 EDT 2000 | Jason

I am new to wave soldering. Any information is greatly welcomed. Here is the problem. After soldering the boards they have a film on the bottom of them and sometimes a white powder looking substance. I have tried decreasing the amount of flux on

Re: wave solder

Electronics Forum | Mon Jun 12 14:03:12 EDT 2000 | MikeF

Jason, First, check with the manufacturer of the flux you are using. They can tell you what board topside temperature range the flux is designed for. Some other info is needed for the residue part. Is it showing up on the same board, or different boa

Re: wave solder

Electronics Forum | Tue Jun 13 12:03:10 EDT 2000 | Chris May

Jason, If 225C is the topside temp of your board just prior to hitting the wave, I would say this is too high. Your flux suppliers data sheet should tell you an ideal topside temp for good flux activation, probably around 190C. According to the Bi

solder joint problem?

Electronics Forum | Mon Jun 12 06:45:10 EDT 2000 | kim ji tae

Hi! Thanks all who upgrade these pages. I have some questions. Is there any answer? I do double-sided reflow solderig, with 0.4% AG solder cream. with AU finished pcb. First I do reflow solder bottom side where 0.5pitch TQFP locates. Second I do re


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