Electronics Forum | Tue Oct 01 16:18:16 EDT 2002 | davef
Q1: Is this [paste in hole] feasible? A1: Yes, many people lower their operating cost by reflowing through hole components. Q2: What types of components are difficult to do this way [paste in hole]? A2: Types of through hole components that are d
Electronics Forum | Fri Apr 21 12:43:51 EDT 2000 | David
We are going to hand place through hole connectors by screening them top side in a double sided reflow board. I saw this done before sucessfully on a daily basis but is there anyone with a paper or specs as to what aperture size, any special pad cons
Electronics Forum | Tue Oct 01 15:48:56 EDT 2002 | lysik
No problem. A standard stencil is OK. You want to print a half moon shape on each side of the hole. Make sure you print about X2 the size of your hole and make sure you keep the print in close to the hole. You want to print X2 the hole size as to hav
Electronics Forum | Tue Oct 01 12:23:26 EDT 2002 | barryg
We are looking at possible doing a few through hole components on the smt line. Is this feasable? What types of components are diffucult to do this way? What stencil considerations are there? Anyone have any info on this subject?
Electronics Forum | Thu Oct 03 04:04:10 EDT 2002 | Bob Willis
SMTNet has a video tape and interactive CD ROM on Intrusive Reflow Soldering that you may want to check out. In addition there are some free inspection standards for pin in hole printing, placement and soldering available at http://www.dpmo-monitori
Electronics Forum | Fri Oct 04 12:02:53 EDT 2002 | mzaboogie
Hi Barry, One consideration that you may want to consider is the lead to hole ratio. The higher the ratio, the less solder is required to fill in the gaps and give you a fillet. Heat is a concern. You will need to ensure components will take the he
Electronics Forum | Tue Oct 01 16:22:46 EDT 2002 | stepheno
You have to be sure the TH parts can take the reflow temps. A lot of time you willl have to get special components. We do some BNC's this way, but they had to be special order BNC's. There is more info in the fine SMTnet archives.
Electronics Forum | Tue Jan 30 12:03:15 EST 2001 | slthomas
Pete, I'm wondering how much optimisation you needed (or were allowed) to do with respect to connector design. The first one we evaluated had a row of leads that I can only describe as "crescent" shaped in cross section. Impossible to get even 50%
Electronics Forum | Mon Jan 29 20:31:44 EST 2001 | davef
It's common. We've talked about it here several times. Hopefully the fine SMTnet Archive that are available are helpful. If there not talk back. Other sites that are sources of information are: * SMT Magazine * Bob Willis * Phil Zarrow * Amp[c
Electronics Forum | Wed Jan 31 01:41:00 EST 2001 | pjc
Steve, I have no influence over conn design. We paste print-reflow solder two types of connectors. One is a 50 pin IDC w/ 0.5mm lead dia @ 2.54mm lead pitch and a chamfered pointed lead tip. The other is 32 pin DIP w/ 0.36mm lead dia @ 2.54mm pitch
