Electronics Forum | Thu Aug 29 17:45:54 EDT 2002 | nifhail
What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont
Electronics Forum | Mon Dec 14 10:53:10 EST 1998 | Earl Moon
| Has anyone had any experience with using this alternative plating process? Some board houses are pushing toward this plating. Is there any long term data on this process? Any problems experienced with smt and thru-hole? I've heard tin whiskers to b
Electronics Forum | Mon Nov 07 17:45:37 EST 2022 | emeto
Hello all, Can anyone advise if any standard covers ENIG plated boards shelf life? Or share what you do for bare boards storage and expiration criteria?
Electronics Forum | Wed Nov 09 07:43:12 EST 2022 | micropak
ENIG boards have low shelf life as oxidation starts showing up quickly on the solderable areas. We usually keep them vacuum packed till they are ready to be assembled. Most PCB manufacturers will send them vacuum packed.
Electronics Forum | Thu Nov 10 11:59:31 EST 2022 | dontfeedphils
Probably preform some sort of solderability evaluation on the PCBs.
Electronics Forum | Sat Nov 12 12:11:22 EST 2022 | micropak
Thank you Stephen... I also mistaken it with Immersion Silver.
Electronics Forum | Mon Nov 14 13:47:10 EST 2022 | emeto
kumarb would you just check PCBs for solderability or would you do something in addition?
Electronics Forum | Wed Nov 09 17:18:08 EST 2022 | emeto
If they are vacuumed and they approach 6months or 1 year mark, what would you do?
Electronics Forum | Thu Nov 10 12:29:57 EST 2022 | stephendo
The G in ENIG is gold. It does not oxidise. Either you are thinking of OSP or your board shop is providing defective boards if your boards show oxidation. It would be the nickel that is oxidising but should be totally covered by the gold. Is there
Electronics Forum | Thu Nov 10 20:39:44 EST 2022 | SMTA-64386598
The solderability shelf life of ENIG is related almost entirely to diffusion of O2 through the gold plating. When O2 diffuses through the gold, the underlying nickel is oxidized rendering it unsolderable (with ENIG - you solder to Ni, the gold dissol
