Electronics Forum | Fri Aug 01 02:10:26 EDT 2008 | fowlerchang
Pad design is not only the size of pad but also the distance between two pad. N2 will increase tombstone as we tested. 10 zones reflow oven and slow temperature ramp will reduce this defect. MustII is the equipment which is used to test the solderabi
Electronics Forum | Sun Sep 15 15:08:00 EDT 2002 | jersbo
My 2 cents... Screen printing may very well have a leg up on deciding SMT defects... however if you pay attention to your stencil (aperture size ratio etc..) and inspect your prints... I believe its a much lesser number... (paste MFG also plays a ro
Electronics Forum | Tue Mar 11 09:49:59 EST 2003 | MGARCIA
DO YOU KNOW? WHAT KIND OF SOLDER PASTE IS BETTER IN ORDER TO AVOID THE TOMBSTONE DEFECT IN SMT PROCESS.
Electronics Forum | Mon Sep 17 10:09:45 EDT 2001 | martys
What variables that you have tested are sensitive to producing tombstoning defects and what advice can you provide to minimize them?
Electronics Forum | Mon Nov 21 10:12:11 EST 2011 | callckq
All, I try to find explanation(Article)on how Nitrogen gas can make tombstone defect even worst. However, I can't find one in the net. Anyone that has this information or article, appreciate if you can share with me...Thanks in advance.
Electronics Forum | Sun Apr 13 19:57:51 EDT 2003 | Thomas
I saw some specifications on the Tamura RMA-012 FP stating that it counters tombstoning...hope it helps you problem...
Electronics Forum | Sun May 04 22:10:20 EDT 2003 | Thomas
Did u ever try a anti-tombstone solder paste to try to eliminate this problem ??
Electronics Forum | Wed May 07 09:24:33 EDT 2003 | davef
Kris The majority of our tombstoning in very small passive SMT is caused by imperfections in end-cap solderability protection plating.
Electronics Forum | Tue Sep 18 10:22:22 EDT 2001 | jschake
Paste Flux / Reflow: Our experiments indicated that the combination of no-clean solder paste and air forced convection reflow produced the fewest tombstone defects, followed by water-soluble paste reflowed in air, and most tombstones occurring with
Electronics Forum | Fri Apr 04 05:02:08 EST 2003 | alexyalung
Hi All, The best solution we made on our tombstone defects is component Z dimension set at pick and place machine. Usually for 0402 components Z height is pre-set by the machine at 0.5 mm, by reducing it to 0.35mm we have solve our tombstone problem
