Electronics Forum | Tue Jun 25 09:55:25 EDT 2013 | bandjwet
We are looking for a recommendation for a company that can perform solder ball inspection on BGAs. The devices are in trays and the the challenge is the ultra fine pitch (0.4mm) and ball size (0.25mm diam). We are looking for ball diameter and coplan
Electronics Forum | Thu Jul 19 18:15:15 EDT 2012 | jil2000
We have a material that is been stick at cover tape, only 1 supplier is failing and only embossed tape packing is failing. A dark spots between tape and component are observed, we already bake material to se if is humidity, is not. We already apply
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