Electronics Forum: underfill void (Page 1 of 2)

BGA underfill

Electronics Forum | Tue Sep 20 08:53:13 EDT 2011 | jocelynlauzon

My company is looking for an IPC expert consultant in BGA underfilling to support an important contract that is being prepared. We are looking for someone with hands-on experience with large (~2"x2", with as much as 1800 pin, 1mm pitch, 0.5mm ball di

Voiding in Underfill process

Electronics Forum | Mon Jan 21 11:37:35 EST 2008 | rayjr1491

Is there a tool to check for voiding in a Underfill process?

Voiding in Underfill process

Electronics Forum | Mon Jan 21 15:45:05 EST 2008 | davef

Yes. It's called a surface acoustic microscope. Rent time at your local university or college.

Voiding in Underfill process

Electronics Forum | Mon Jan 21 16:02:41 EST 2008 | rayjr1491

hi dave Is there another tool besides SAM (Scanning Acoustic Microscopy)? Regards, Ray

No Clean and Underfill

Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo

No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux

Voiding in Underfill process

Electronics Forum | Wed Jan 23 13:48:06 EST 2008 | flipit

You can do a destructive test to sort of check your process. Break off the flipchip and look for voids. I have used Namics 8437-2 for the last 7 or 8 years. Good stuff. Flows under a 0.001" gap with no voids. Chris

Voiding in Underfill process

Electronics Forum | Mon Jan 21 18:58:21 EST 2008 | davef

We have read papers espousing using xray, but have never seen such a thing. It seems the contrast provided in the xray images is insufficient for analysis of the underfill.

Voiding in Underfill process

Electronics Forum | Tue Jan 22 09:48:09 EST 2008 | davef

Here's an article on flux / underfill compatibility http://ap.pennnet.com/articles/print_toc.cfm?p=36&v=16&i=6

Voiding in Underfill process

Electronics Forum | Tue Jan 22 07:50:20 EST 2008 | rayjr1491

Thanks Dave, I spoke with a Loctite application person yesterday and the mentioned SAM as well. best regards, Ray

Xray help

Electronics Forum | Wed Jun 06 11:19:21 EDT 2007 | ramseyn

Hello. What kind of void are you seeing? You said the part was a BGA, is it being underfilled or is it a solder void?

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