Electronics Forum | Thu May 07 08:31:13 EDT 1998 | Alan Pestell
We are about to use BGAs on our equipment. We clean all products prior to confomally coating them - to keep moisture off the IC legs. Will this be a problem with BGAs. Will we need to get the coating underneath the BGA or will the pitch on the balls
Electronics Forum | Thu May 07 15:56:43 EDT 1998 | Terry Burnette
80ppm). The CTE of your board and solder joints will typically be 18-22ppm. We have seen cases were the coating fills the gap between the component and the board, then during temperature cycling the coating expands to the point of breaking the solder
Electronics Forum | Mon Aug 13 08:16:19 EDT 2007 | davef
Your theory is reasonable about a component issue. You need to investigate the solderability of the pads on the BGA interposer.
Electronics Forum | Mon Aug 13 09:07:47 EDT 2007 | pavel_murtishev
Good morning, Does BGA pin configuration allow to add one glue dot? Is you PCBA populated with BGAs from both sides? BR, Pavel
Electronics Forum | Fri Aug 24 10:22:35 EDT 2007 | frodriguez
Did you check your board finishing? If you are using ENIG finishing on your board you may have a Black Pad issue which causes BGA falling apart from the board
Electronics Forum | Mon Aug 13 05:39:31 EDT 2007 | saaitk
I am building a double sided SMT board. On the first side I have a 405 ball BGA. When we build and run the second side through our reflow oven on about 25% of the boards run the 405 ball BGA on the underside of the board has fallen off. About 80% of
Electronics Forum | Mon Aug 13 10:00:18 EDT 2007 | ed_faranda
Might want to check to see if the weight of your part has increased. If it has increased, you may not have enough surface tension to hold the part on the board. I am assuming you already checked that the component isn't getting hit by something in
Electronics Forum | Mon Aug 13 11:05:18 EDT 2007 | saaitk
Would I be correct in assuming that the solder used to attach the BGA ball to the device body should have a higher liquidous point that the solder used to attach the device to the board. If the peak reflow temp for SnPb is around 225 deg should the b
Electronics Forum | Mon Aug 13 22:39:36 EDT 2007 | davef
The solder used to attach the BGA ball to the BGA interposer would have a liquidous point dependent on the type of solder used by the device fabricator. If this is a lead free device [altho we don't think so], the solder used by the fabricator would
Electronics Forum | Wed Jan 30 21:56:47 EST 2008 | rayjr1491
On the DEK Horizon there are two options for underside cleaning one is a foam cleaner and paper cleaner that advances. The Foam cleaner cleans using liquid but does not increment and foam piece and can be washed but there are still contaminents. We h
