Electronics Forum: universal instruments

NPL Lead Free Soldering Survey

Electronics Forum | Mon Jan 11 11:33:36 EST 1999 | Bob Willis

As part of an analysis of the status of lead-free soldering National Physical Laboratory in the UK is undertaking a short survey, and would be grateful if you would spare a few minutes to answer a few questions. The SMART Group is providing five Int

Use lead-free alloy wire during rework for Leaded Process

Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef

What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC

Universal Instruments Radial Inserter

Electronics Forum | Mon Jul 30 15:28:25 EDT 2007 | gmoritz

I'm posting a diary of the major repair experience that we had this weekend. I'll follow up with a shorter post that sort of summarizes a few things. ------------------------------------------------ The service guys showed up at our facility about

Optimal Speed for Universal Chip Shooters

Electronics Forum | Wed Jun 11 16:30:33 EDT 2003 | T.Vick

You have received some great feedback so far. I would like to summarize and add a few points regarding maintenance. You should start (as recommended already) by verifying your component library data. Using the default values from the master library i

Re: Fillet Lifting

Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary

The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate

Question of delamination in PCB

Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef

From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff

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