Electronics Forum | Fri Oct 03 10:52:32 EDT 2014 | rgduval
Thanks for the suggestion, Arifa. However, it doesn't look like any of these are for the Universal Instruments GSM2 pick and place machine. The Keller-Druck link is for a GPRS Modem with a datalogger. The Sparkfun and Cybrotech sites seem to be
Electronics Forum | Tue Jul 14 10:24:33 EDT 1998 | JMCoogan
Wayne We (Universal Instruments) started demonstrating the placement of 0201 chips at the last Productronica show in Germany. But at this point in time, you will be hard pressed to find anyone using it in production (although the placement equipment
Electronics Forum | Thu Aug 19 11:58:12 EDT 2010 | davef
From "Universal Instruments Packaging Specification" ... [snip] Packing Of Populated Boards · These parts require individual separation and protection to prevent electro static discharge and structural damage. They shall be packed in sealed, anti-st
Electronics Forum | Thu Sep 10 15:29:15 EDT 1998 | matthew park
Tim, What is it? Which ones are you talking about: 0.080" vs 0.008", 0.100" vs 0.010", or 0.050" vs 0.005" pitch devices . If you are saying 0.080",0.100" and 0.050", any pick and place machine can handle that. Well if not, one machine that is ca
Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Wed Mar 18 09:03:57 EST 1998 | Earl Moon
| Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago | that deals with this exact subject. Best way to deal with this is to use a ce
Electronics Forum | Wed Oct 09 08:36:44 EDT 2002 | pjc
Operation features of many devices, machine components, instruments depend substantially on state of their surfaces. Selective surface processing by high-intensity energy beam (ion, electron, laser treatment) is one of the most perspective directions
Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F
| I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from | year 2000. Can anyone tell me if this is true | Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release
Electronics Forum | Tue Jan 11 09:47:01 EST 2000 | Dave F
Abbas: Sources of information on DFM/DFT are: � "SMTnet Express" articles on DFM by Earl Moon � IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies' � Books in SMTnet and SMTA book stores � Other examples ar
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