Electronics Forum | Sat May 17 11:11:42 EDT 2008 | azimi789
would anybody guide me about soldering and unsoldering the BGA ic with Infrared unsolder dais please? in what range of temp. and time I should set the device? (ZORAN Quatrro 4110)
Electronics Forum | Wed May 21 20:52:17 EDT 2008 | davef
Did you get the solder to the temperature? Determine the temperature of the solder with a thermocouple.
Electronics Forum | Thu May 22 02:25:15 EDT 2008 | lococost
No, absolutely not. The BGA balls should collaps by theirselves. No external pressure should ever be applied.
Electronics Forum | Mon May 19 08:18:22 EDT 2008 | davef
You should set the temperature at liquidus point of the solder used on the BGA plus 20 to 25*C. So, for tin-lead that would be ~215*C. Most lead-free solders run about ~20 to 25*C higher than that.
Electronics Forum | Tue May 20 10:27:29 EDT 2008 | azimi789
I just set that as you said, but the component doesn't stick on the board. I use AMTECh Flux type: RMA-223.. what should I do ? Thanks.
Electronics Forum | Thu May 22 01:37:31 EDT 2008 | azimi789
I found out that the light is not heterogeneous, i am trying to solve this problem... from my web surfing I encountered an article that claimed there should be 200 grams Placement Pressure on the BGA while soldering ... is that really needed? 200 gr
Electronics Forum | Mon Oct 13 15:34:22 EDT 2003 | John
Anyone ever noticed a difference in measuring the temperature on a soldered board vs. using an unsoldered mole in their wave? I've been looking at the temperature of a specific part, and it reads much higher on an unsoldered mole vs. a soldered mole
Electronics Forum | Wed Jan 28 20:26:32 EST 2004 | Vinny
Hi Guys, Really need your help to suggest how to tackle this situation.
Electronics Forum | Tue Sep 22 06:07:02 EDT 1998 | jacqueline coia
need advice to point me in the correct direction for solution to the problem of unsoldered joints which look soldered under normal visual inspection, but when pull strength test is performed the leads are coming away from pad, no strong intermetallic
Electronics Forum | Thu Aug 29 20:02:58 EDT 2002 | davef
Often assemblers leave areas unsoldered for future component additions, modifications, and test points. On imm silver boards, these unsoldered areas become a real bear to solder/test later in life. One way to avoid that problem is deposit some solder
