Electronics Forum | Tue Jan 23 22:21:15 EST 2001 | rpereira
We have evaluated 4 different AOI machines and the General Scanning 8200 machine was the best. Great G R&R. As far as paste height goes, it is very paste dependant. I recently completed a DOE comparing laser stencils to EFab, varying 0.5 mm pitche
Electronics Forum | Tue Nov 25 18:39:59 EST 2014 | rhcriad
We have an MPM UP2000 stencil printer and have a lot of issues with burned out 6410 driver cards (or driver cards just failing to work). I have looked over these threads and found that this is a common issue with these cards. I understand that thes
Electronics Forum | Tue Aug 25 20:33:31 EDT 1998 | Karlin
| | | | Hi, | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | We have rule out the possibility of not printin
Electronics Forum | Wed May 30 17:59:16 EDT 2001 | jollyrodger
It may be the case (if you are using stencils to apply the epoxy) that you will have to indeed use a stepped stencil to appply the epoxy at a greater height. Not being an engineer i am not completely clear with the involvements of stencil design -
Electronics Forum | Wed May 30 17:59:24 EDT 2001 | jollyrodger
It may be the case (if you are using stencils to apply the epoxy) that you will have to indeed use a stepped stencil to appply the epoxy at a greater height. Not being an engineer i am not completely clear with the involvements of stencil design -
Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane
i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red
Electronics Forum | Sat Feb 02 07:07:47 EST 2013 | bandjwet
The keys to avoiding the voids we have found are: 1. Proper reflow profile 2. Proper stencil design 3. Prebumping using either a metal stencil or StencilMate stencils (and then using paste flux to attach later) http://www.solder.net/products/stencilm
Electronics Forum | Mon Jan 20 03:13:34 EST 2020 | silverlead
Included screenshots from DEK manual, outlining stencil depth adjustment. Basically, distance from rear of the stencil to the front of the image is value needed to be set on scale when positioning stencil. There is an other way to adjust stencil, by
Electronics Forum | Fri Nov 08 09:24:16 EST 2002 | rspoerri
Hi, I'm setting up an new production line for cell phone manufacturing and am looking for a second printer for the back half of the line. I am looking at both new and used though used is looking pretty attractive due to the glut of equipment curren
Electronics Forum | Tue Nov 26 09:19:29 EST 2002 | pjc
MPM UltraPrint 2000 2D Inspection Times: QFP 256 pin 16Mil pitch is 7.5 seconds BGA 225 ball 20Mil pitch is 1.8 seconds Find out the DEK times for these devices. Any UP2000 of 1995 mfg. date oand on can be upgraded to the latest software. Concer
