Electronics Forum | Fri Sep 14 01:43:36 EDT 2001 | dhanashekar
please check the following also. in one of the cases we came across the second point was the problem. 1. the parallelisum of the conveyor. 2. the warpage of the board. 3. the stencil.(the differential height in the paste deposition of the two pads
Electronics Forum | Wed Mar 02 05:04:36 EST 2005 | ABHI
What is your micro BGA requiremnets? I mean ball dia / height with a 0.5 mm pitch? I can give you the stencil design, if you make known the parameters.
Electronics Forum | Tue Apr 12 04:37:52 EDT 2005 | chandran
1.Can anyone explain to me what is the clean and non clean solder? 2.What is the standard solder paste height spec for stencils 4mils,5mils and 6mils? 3.Whatis the meaning for ROHS?
Electronics Forum | Wed Apr 27 12:26:49 EDT 2005 | jdumont
Square you say? Wouldnt this give less paste deposition than a circle and basically reduce the standoff height the same as making the pad bigger? Would using a type 4 paste for this size stencil aperture (.013") be a good idea? Thanks JD
Electronics Forum | Thu Feb 23 23:24:14 EST 2006 | KEN
Depends what is adjacent to the step. 1206 chips could reside closer than say a 16 mil fine pitch. Larger apertures are more forgiving to height variations than small apertures.
Electronics Forum | Tue Feb 28 07:47:33 EST 2006 | davef
The key driver to aperture design is to assure a fillet of the proper height for the component temination and the reliability of the end-product customer use environment.
Electronics Forum | Fri Jun 02 08:50:47 EDT 2006 | russ
Hmmm interesting, we utilize 5 mil stencils and print to same height as you and do not experience these failures. May I ask what paste you are using and what the spacings are of your pad design? But anyhow, if it works it works.
Electronics Forum | Fri Jul 31 17:17:12 EDT 2009 | isd_jwendell
If the sensor can survive the 200C in the molding machine, then could it not survive Pb-free soldering? Maybe not convection reflow, but it should be able to survive vapor-phase reflow. I would control solder height by controlling the amount of paste
Electronics Forum | Thu Apr 30 23:21:52 EDT 2020 | SMTA-Davandran
I am seeing a lot of solder ball for PIP process. is it due to the paste height go beyond 0.2mm.? what is the DOE need to focused for PIP process?
Electronics Forum | Tue Aug 22 15:24:08 EDT 2023 | grayumm
Evtimov, here is a picture of what we are seeing. After evaluating with the IPC-A-610 book it looks like we are getting an insufficient Heel Fillet Height. I will add a picture of an example. UPDATE: i cannot figure out how to add a picture to this m
