Electronics Forum | Thu Sep 22 14:25:13 EDT 2011 | hegemon
Dave has stated the caveats well. I too have similar experience in reworking BGAs that mirrors your own. The only situation where I saw this as an issue, was in memory devices where a row of BGAs might share a commonm heatsink. In those cases the
Electronics Forum | Mon Apr 30 18:34:35 EDT 2012 | hegemon
Pure Tin terminations can be mitigated for components with solder terminations less than .030" in height from the PCB, by using 6 mil stencil with Sn63/pb37 solder paste. That's the simple story for our customers that require it. Beyond that height w
Electronics Forum | Sat Aug 03 08:44:11 EDT 2002 | P. Kannan
We are having 3 MPM UP-2000 printer & 1 AP-25 printer with us. I would like to have the technical guidance for my following application. For one of our model, there is a requirement of Glue & solder paste on same side of the PCB. Currently we are u
Electronics Forum | Mon Nov 25 20:57:23 EST 2002 | Kermit
Thanks to everyone who has responded so far. We are going with dedicated tooling for our phone cards but not for our system cards so that takes that out of the equation for the former, will evaluate for the system bds.. Thanks for the info.. Regard
Electronics Forum | Mon Sep 21 22:25:05 EDT 2009 | davef
What babies!!!! Sure, give it a try. * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print height equals 1/3 thickness] * For 0603, a
Electronics Forum | Fri Oct 09 06:32:38 EDT 2009 | davef
Here's what is on that post referred to, not sure what you need more than ... "* Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print
Electronics Forum | Tue Nov 03 11:46:52 EST 2009 | davef
Search the finee SMTnet Archives for previous posts on the topic. Here's a clip from on of those posts that may get you started. [snip] * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, availa
Electronics Forum | Thu Jun 24 15:44:12 EDT 1999 | Earl Moon
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Thu Mar 29 02:14:07 EST 2001 | peterson
AOI technology is over-priced and inconsistent...lots of false errors. Your best bet is a paste height measuring device (3-D) Cyberscope makes one for 25-30 thousand. This process is really only necessary for high volume operations. As for you questi
Electronics Forum | Mon Jan 17 08:09:05 EST 2000 | Mark Anderson
As stated previous, the following elements all have a effect on solder beading. Solder Paste, stencil apertures(reduction of home plate), stencil thickness, printing parameters, placement height, reflow preheat and soaking slope and dwell, manufactur
