Electronics Forum | Tue Oct 12 10:24:50 EDT 1999 | Jose RG
Hi, We are in the way to evaluate different solder pastes, improve our solder paste incoming inspection steps, re-define our stencil requirements and the following questions are open. Two questions, 1- Is anybody using/requiring 1000 Kcps or more
Electronics Forum | Fri Aug 09 11:59:31 EDT 2002 | bcceng
Tom, I developed a process for applying solder bumps on BCC32 and BCC48 successfully on my previous employer. The quantities were in the thousands a week, the following process is what I was using: Insert BCC's on process carrier (carrier holds 500
Electronics Forum | Tue Jun 17 08:52:39 EDT 2003 | russ
Aspect ratio = width of aperture divided by height. E.G. 6 mil stencil at 9 mil wide = aspect ratio of 1.5. Value should be 1.5 min. Area ratio - use when length and width of pad are roughly same dimension like for BGAs and 0805 and smaller R-nets
Electronics Forum | Mon Apr 11 15:37:29 EDT 2005 | GS
For 1,27 mm Column Pitch, we set our process like this: - Stencil 0,20 mm If allowed also for other SMDs otherways some time 0,150 with step up stencil used only for CCGA area. - paste height min 0,175 mm - aperture 0,75 to 0,8 mm - paste volum
Electronics Forum | Tue Feb 13 11:20:59 EST 2007 | cevans MPM printer specialist
Off contact is generaly less favourable than on contact printing. print height becomes a issue towards the edge or foil clamps. If you Had little or no issues with your previous board vendor re-check your specs you supplied to your current vendor. If
Electronics Forum | Tue Feb 20 06:05:10 EST 2007 | mk
Thanks to all for the info. The ideas to correct the situation are all excellent and if we see any more boards from this source with this condition we will know what to do now. In the end however, the real questions we are trying to answer are, 1.I
Electronics Forum | Thu Nov 12 04:35:13 EST 2009 | sachu_70
You can certainly venture out to the nearest lab for in-depth analyses. But since you mention 2-3% defectives in a batch, there is much you can do in-house as well. Measure the height of your solder paste deposit (in zero print gap condition)across a
Electronics Forum | Thu Apr 21 20:09:18 EDT 2016 | adamjs
I have tried adding more paste but get shorts and excess flux as I get above a 7 mil stencil. You do need the thicker stencil. To prevent the shorts, you need to have your pick-and-place machine probe the exact height of the board (at multiple loca
Electronics Forum | Fri Jan 20 20:57:26 EST 2023 | hi_fonsi
We have a PARMI SigmaX SPI (Solder Paste Inspection) machine, right now I'm trying to understand about parameters of the machine. I know minimus, Maximus, and warning values need to be defined. Height value understands that can be defined by the thic
Electronics Forum | Mon Jan 28 16:48:14 EST 2002 | djarvis
Printing with adhesives is no big deal so don't let the sales types try to mystify the process and convince you that they have the only stencils/adhesives/knowledge that can possibly get you through this "trying time" - at a price. Start with 0.010"
