Electronics Forum | Tue Mar 16 08:38:59 EST 1999 | George Verboven (Process Engineer)
| | In the early days, we used screens made of stainless steel or polyester. Sometimes - after A period - the tension was not good, because A wire was broken. | | Later on we started to us metal stencils, glued in A polyester screen. even than we had
Electronics Forum | Wed Dec 02 16:35:21 EST 2020 | kylehunter
> Hi Kyle, As per IPC 610, for class 3, this is > not acceptable, as your minimum fillet height has > to be either one of these two, whichever is > less: - solder thickness + 25% of the termination > height - solder thickness + 0.
Electronics Forum | Mon Feb 22 12:04:15 EST 1999 | Dave F
| Please could you suggest a recommended aperture sizes for | printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated. | Mark: About the only rule of printing adhesives is: Keep it off the
Electronics Forum | Thu Sep 28 07:09:01 EDT 2000 | Rich Ziebell
All, We are experiencing extreme difficulties in printing with a water soluble paste. We have tried two major brands of w/s paste and we are seeing the same problems with both. The main issue is the paste is sticking to the blades. We have tried di
Electronics Forum | Fri Jul 13 19:08:55 EDT 2001 | mparker
Home plate apertures are designed to reduce or eliminate solder balls that occur when placing a chip and reflow of the solder. This aperture type is usually desired when processing with a "no-clean" solder paste. The design of the aperture is usually
Electronics Forum | Tue Sep 24 12:49:43 EDT 2002 | dragonslayr
Aperture reduction @ 5 mils thickness is your best bet. It may take several attempts to get just the right paste volume. What aperture reduction was specified to the stencil house for these specific LEDS? or was the stencil blindly produced using a
Electronics Forum | Fri Nov 23 06:34:43 EST 2012 | bandjwet
With all of the various techniques available for LGA rework including but not limited to: Bumping the part using a polyimide stencil http://www.solder.net/products/stencilmate Bumping the part using a metal fixture or http://www.finetech.de/advance
Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan
Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref
Electronics Forum | Tue Nov 12 09:04:21 EST 2019 | mario85
Hello Guys, I'm new here. I am smt process engineer in new company located in Poland. I am responsible for whole smt line, so I have a lot of problems at the beginning :). I would like to ask about few things. The topic is solder balls. I produced s
Electronics Forum | Mon Jan 15 16:32:46 EST 2001 | Darby
Adrian, I'll go again. The term "snap off" on it's own refers to the distance between the bottom of the stencil and the top of the pcb. Sometimes referred to as "print gap". As you prefaced your question with "squeegee snap off" I thought you were as
