Electronics Forum: used equipment (Page 239 of 262)

Re: Quad vrs. Mydata

Electronics Forum | Mon Nov 09 22:33:42 EST 1998 | Jim McCarten

I have had experience with both companies. If you are doing contract work and get you parts and boards in a box, the Mydata does a fine job of teaching a board on the machine. Quad's strengths are in their software and the ability to automatically

Re: Big SMEMA Troubles :-(

Electronics Forum | Wed Nov 04 18:13:53 EST 1998 | Michael Allen

I assume that you're dealing w/ Universal's SMPI connectors (and possibly their cables too). We've fabricated "conversion boxes" to accomplish what you're trying to do. These boxes have a female SMPI plug on one side, a female SMEMA plug on the opp

I'd like that fax, if you're still willing to send it.

Electronics Forum | Thu Nov 05 09:10:23 EST 1998 | smd

MA: my internet e-mail isn't working at the moment, but I'd really love to see the conversion you created. My fax is 716-256-0792. Do you have a Dek printer or Omniflow oven? Many thanks to you. | I assume that you're dealing w/ Universal's SMPI co

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis

There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ======

Re: Stress on surface mount components during depaneling

Electronics Forum | Fri Jul 17 11:57:25 EDT 1998 | Justin Medernach

| I am looking for information on the amount of stress a component sees during the depaneling process. I am currently specifying a new piece of depaneling equipment and I have not found any studies that quantitatively compare the amount of stress di

SECS/GEM this is what I want

Electronics Forum | Tue Jun 16 12:39:25 EDT 1998 | Nancy J Dawdy

| As an equipment vendor (Panasonic Create group)I am extremely interested in GEM/SECS. It is really a nebulous concept. Everyone I talk to wants something different but it's all lumped under GEM/SECS! I ask a simple question. What do you want it t

Placement Program Control

Electronics Forum | Mon Aug 06 09:08:55 EDT 2001 | wbu

Dave, so what�s a good program anyhow? What about the setup configuration ? ... and who�s gonna say that your so optimized program will run after month and month while your equipment has gone through several aging and whatever processes? So we all

Placement Program Tweaking

Electronics Forum | Mon Oct 15 23:23:13 EDT 2001 | kenbliss

Hi Dave, Although I am just a blathering salesman trying to sell carts, I am not offering any here. I do have a few thoughts on your CAD positioning issue and tweaking. We do have full CNC sheetmetal puching equipment in our facility and it operate

Filling via holes during the reflow process

Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef

Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via

BGA process requirements

Electronics Forum | Thu Apr 11 18:47:43 EDT 2002 | slthomas

A couple of questions to establish a baseline for when the check writers start asking questions........ How many of you have vision systems on site for BGA inspection? If you don't have it, do you do 100% X-ray, or did you just nail down the proces


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